NEW to EMC+SIPI 2024: Global SIPI University Course!

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ANNOUNCING THE INAUGURAL COURSE

Global Signal Integrity and Power Integrity (SIPI) University

WEDNESDAY, AUGUST 7, 2024

COURSE OVERVIEW: Signal integrity (SI) and power integrity (PI) are gaining an ever-growing attention due to today’s higher data rates and larger currents in high-speed digital systems. Industries call for skilled engineers with both basic and advanced background in these two disciplines. Courses dealing with SI and PI related topics at academic level are limited and offered by only a few institutions and research laboratories in the US and worldwide. The inaugural “Global SIPI University” aims at bridging this gap with a one-day introductory course at the Electromagnetic and Signal & Power Integrity Symposium to be held in Phoenix, Arizona, from August 5-9, 2024.

COST: $175 Advance / $225 After July 1

Note: A full symposium registration is required in addition to this course fee.

TIME

TOPIC

PRESENTER/INSTRUCTOR

08:30 – 9:00

Registration / Introductions

Christian Schuster and

Francesco de Paulis

09:00 – 09:45

Opening: Progression of SIPI Modeling: A 50-Year Journey to Modern System Design Challenges

Dr. Albert Ruehli

(Missouri University of Science and Technology)

Mr. Stephen Scearce

(Cisco Systems)

09:45 – 10:30

Keynote: Global industry trends and demands from a system and packaging perspective

Dr. Kemal Aygün

(Intel)

10:30 – 10:45

Coffee Break / Networking

10:45 – 11:30

Signal Integrity I: Passive interconnect design, lumped effects, transmission line effects

Dr. Bhyrav Mutnury

(Dell EMC)

11:30 – 12:15

Signal Integrity II: Electrical Signaling —Modulation, Equalization, and Channel Design

Dr. Wendem Beyene

(Meta)

12:15 – 13:30

Lunch Break / Networking

13:30 – 14:15

Signal Integrity III: Signal integrity measurements and simulation

Dr. Eric Bogatin

(University of Colorado, Boulder)

14:15 – 15:30

Power Integrity I: Fundamentals of power integrity with practical analysis techniques for current and emerging designs

Dr. Ihsan Erdin

(Celestica)

15:30 – 15:45

Coffee Break / Networking

15:45 – 16:30

Power Integrity II: VRM, package/IC-level PDN design

Dr. Chulsoon Hwang

(Missouri University Of Science and Technology)

16:30 – 17:30

The Future of SI & PI Engineering: Open discussion with all instructors and attendees

Christian Schuster and

Francesco de Paulis

CO-CHAIRS

CHAIR:

Christian Schuster

Hamburg University of Technology, Germany

Christian Schuster (IEEE Senior Member) received a Diploma degree in Physics in 1996 and a Ph.D. degree in electrical engineering in 2000. Since 2006, he is a Full Professor at Hamburg University of Technology (TUHH), Germany. Prior to TUHH he was with the IBM T. J. Watson Research Center, Yorktown Heights, NY. His current interests include signal and power integrity of digital systems, multiport measurement and calibration techniques, and development of electromagnetic simulation methods for communication electronics. He serves as an Associate Editor for the IEEE Transactions on EMC as well as an Adjunct Associate Professor at the School of Electrical and Computer Engineering of the Georgia Institute of Technology.

CO-CHAIR:

Francesco de Paulis

University of L’Aquila, L’Aquila, Italy

Francesco de Paulis (Senior Member IEEE) received the M.S. degree in Electrical Engineering in May 2008 from Missouri University of Science and Technology (formerly University of Missouri-Rolla), USA, and the Ph.D. degree in Electrical and Information Engineering in 2012 from the University of L’Aquila, L’Aquila, Italy. He is currently an Associate Professor at the Electromagnetic Compatibility and Signal Integrity Laboratory at the University of L’Aquila. His main research interests are in signal and power integrity, high speed channel design and optimization, composite materials for shielding and absorption, RF interference in mixed-signal system, TSVs in silicon chips and interposers, antenna design and measurement techniques, remote fault detection in transmission lines, microwave design of electronic devices and systems for space applications.

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