August 2023

Featured Product of the Month: MRSI-705
MRSI Spotlight
Trade Show News
Blog Insights

Learn why the MRSI-705 is an industry leader in flexibility and reliability

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

The flexible, configurable platform has a large working area, which is perfect for multi-die packaging for multiple applications such as aerospace and defense. The MRSI-705 is an open platform that adapts to fast product change-over. More than 100 waffle packs can be staged on the machine. The system manages complex multi-chip modules and other advanced assembly challenges with ease.

MRSI Spotlight

MRSI increases their bonding accuracy to 0.5 micron

Peter Cronin discusses how their die-bonding platforms have evolved over the years to include an increasing number of high-tech features that increase placement accuracy, handling sensitive devices and placement speed.

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Trade Show News

MRSI to showcase and present innovative die bonder solutions at CIOE 2023

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment applications. The MRSI-H-HPLD+ significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. It can handle a wide range of die sizes and substrates, and can achieve high accuracy with high-speed eutectic bonding.

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Dr. Limin Zhou to present at the China International Optoelectronic Conference

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era” during the Optoelectronic Chip Design, Manufacturing, and Packaging Technology Forum on September 7, 2023. He will share his insights on the challenges and opportunities of optoelectronic chip assembly in the context of artificial intelligence.

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Infostone Optical Communication Market and Technology Conference (IFOC)

At the Infostone conference, we will demonstrate how MRSI creates solutions that match the high reliability assembly requirements in optical devices of automotive LIDAR. We will also preview recent highly reliable and consistent results obtained from deploying an alternative assembly process to assemble optical components for automotive LIDAR.

Dr. Limin Zhou Senior Director, Strategic Marketing, MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “Automotive LIDAR Package & Assembly Technology Evolution Trend” on September 4th, 2023.