High-speed die bonding technology is quintessential for the modern manufacturing landscape, especially within the realm of optical modules. The MRSI-LEAP High-Speed Die Bonders epitomize this technological advancement by delivering unparalleled efficiency, precision, and versatility.

The MRSI-LEAP are engineered to deliver high throughput, making them an invaluable asset in any high-volume manufacturing setting. With a pick-and-place throughput that exceeds 1,000 units per hour (UPH), the MRSI-LEAP ensures that productivity remains consistently high. This remarkable throughput is achieved without compromising the machine’s stability or precision, MRSI is renowned for.

Peter Cronin, Willie Cariazo, Alejandro Espinoza Gutiérrez (our newest team member in Mexico), Jack Inocencio, Max Faretra, Eric Mattson, Miguel Burgos, Ezer Espares, Julius Ortega, Dan Son

MRSI Mycronic has significantly expanded its service team to ensure top-notch global customer support. This includes an additional Service Engineer based in Mexico who has undergone extensive training in the US factory, and a dedicated Service Engineer stationed in Canada. Additionally, spare parts are now readily available in Mexico. MRSI offers industry-leading local technical support teams and application expertise, boasting over 40 years of experience in the industry. Their reliable field operations run 24/7, underscoring the company's commitment to exceptional service and customer satisfaction worldwide.

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product innovations with you. Discover how MRSI is advancing the future of electronics.

IMAPS Device Packaging (DPC) 2025

March 3-6, 2025

Phoenix, AZ USA

Booth: #204

The 21st Annual Device Packaging Conference (DPC 2025) is an event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It is a premier event this spring for the microelectronics assembly advanced packaging, that will bring together distinguished industry engineers, researchers, and experts while showcasing the latest developments in photonics and microelectronics. 

LASER World of PHOTONICS CHINA 2025

March 11-13, 2025

Shanghai New International Expo Center

Shanghai, China

Booth: #N1.1202  

The Shanghai-based LASER World of PHOTONICS CHINA was founded in 2006. Since then, it has focused on the Chinese market and extended to Asia-Pacific region, and further connected with premium exhibitors and buyers in industries of laser, optics and optoelectronics across Asia and even the world.

Annual Government Microcircuit Applications & Critical Technology Conference (GOMACTech)

Conference: March 17-20, 2025

Exhibition: March 18-19, 2025

Pasadena Convention Center

Pasadena, CA USA

Booth: #715

The GOMACTech conference was founded in 1968 with the primary objective of reviewing advancements in microcircuit applications for government systems. The conference focuses on developments within systems engineered by the Department of Defense and other government agencies. It has served as a platform for the announcement of significant government microelectronics initiatives such as VHSIC and MIMIC, as well as providing a venue for government reviews. 

2025 Optica Executive Forum at OFC

March 31, 2025

San Francisco, CA USA

MRSI Mycronic is proud to be a Silver Sponsor of the Optica Executive Forum again this year.

Co-located with OFC, the Premier Event in Telecom and Data Center Optics this is an Optica Industry Event. The Executive Forum features C-level panelists in an informal, uncensored setting discussing the latest issues facing the industry and your business. Leaders from top companies discuss critical technology advancements and business opportunities that will shape the network in 2025 and the future.

Optical Fiber Communications Conference and Exhibition (OFC)  

Technical Conference: March 30-April 3, 2025

Exhibition: April 1-3, 2025

Moscone Center

San Francsico, CA USA

Booth: #3218

The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications. 

With over 13,500 expected registrants from 83+ countries, a showcase of more than 600 exhibiting global companies, and hundreds of sessions with industry-renowned and invited speakers, OFC 2025 is the main event and unparalleled gathering for industry professionals and the global hub for innovation and collaboration.

Topics such as 1.6 Terabit, AI, Coherent PON, Linear Pluggable Optics (LPO), multicore fiber, data center technology and quantum networking will capture the interest of industry leaders, experts, academia, media, analysts and students worldwide, facilitating the exploration of the latest advancements in optical communications and networking technology.

Learn more about the upcoming events.

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