When

Tuesday, June 28 from 11:30 a.m. to 1:15 p.m. EST

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Where

WestGate Academy 
13597 East WestGate Drive
Odon, IN 47526
 

 
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Contact

IN3 Events
IN3 (Indiana Innovation Institute)
info@in3indiana.org

Tech Tuesday

Tuesday, June 28, 2022

 

Tech Tuesday - DARPA Executive to Speak on Agency’s Electronics Resurgence Initiative

Please join IN3 and NavalX Midwest Tech Bridge on Tuesday, June 28, from 11:30 a.m. to 1:15 p.m. for a presentation from Dr. Carl E. McCants, a special assistant to the director of the Defense Advanced Research Projects Agency (DARPA). In his role, McCants focuses on the Microsystems Technology Office’s Electronics Resurgence Initiative (ERI).

At the 2021 DARPA ERI Summit and MTO Symposium, McCants gave an overview of plans for the next iteration, referred to as ERI 2.0. His June 28 presentation will provide an overview of ERI 2.0 and focus on some of the challenges related to manufacturing complex 3-D microsystems.

While ERI 2.0 will continue with the original six research thrusts, DARPA has added two additional thrusts – manufacturing complex 3-D microsystems, specifically 3-D Heterogeneously Integrated (3DHI) components, and electronics for extreme environments. Given that domestic semiconductor production accounts for only 12 percent of chip manufacturing and just 3 percent of packaging, there is a need to create ways in which innovation can be developed and leveraged for commercial and defense applications. ERI 2.0 will develop a domestic prototyping capability for 3DHI components to provide a sustainable path for innovation to move from the laboratory to industry. The R&D needed to enable 3DHI manufacturing includes the design, assembly, testing and digital emulation of 3DHI microsystems, with an emphasis on: a)multi-chip, multi-technology assembly and packaging; b) tools for design, simulation and test; c) security; d) 3DHI interconnects; and e) thermal management and power delivery. This presentation will provide an overview of ERI 2.0 and focus on some of the challenges related to manufacturing complex 3-D microsystems.

Prior to his role at DARPA, McCants was technical director of the Supply Chain and Cyber Directorate of the National Counterintelligence and Security Center (NCSC) in the Office of the Director of National Intelligence. He provided scientific and technical input and briefed senior government leaders on national-level supply chain integrity issues and provided subject matter expertise on microelectronics-related supply chain concerns for the intelligence community and USG interagency groups. In addition, McCants was a Senior Program Manager at IARPA and a Program Manager at DARPA.

The presentation will take place at the IN3 offices in Odon, IN, and will include a light lunch and a networking opportunity.

Location: IN3 offices, located on the 2nd floor of the WestGate Academy    13597 East WestGate Drive
Odon, IN 47526
 

QUESTIONS:

If you have any questions, please contact Julie Griffith, EVP of Strategy, Partnerships and Outreach for IN3 at jgriffith@in3indiana.com.