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August 2021
MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 1-3, 2021. MRSI will be conducting live product demos of the MRSI-HVM die bonder with conveyor at MRSI’s booth #14B79.  
 
The MRSI-HVM with a conveyor is specialized for tray-based applications such as die attach, passive UV lens attach, and in-situ UV curing. It is proven for its’ speed, zero-time tool change between dies, and <1.5 micron accuracy. The superior performance is enabled by dual heads, dual stages, integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations. The MRSI-HVM offers manufacturers speed without sacrificing flexibility, precision or reliability.   
MRSI Shenzhen Demo Center grand opening ceremony  
On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local management, a ribbon cutting event, and an auspicious lion dance show. The MRSI Product Demonstration Center is located at Room 101, Block A, Huahan Innovation Park, Langshan Road, Nanshan District, Shenzhen. It is equipped with MRSI's latest equipment and staffed by experienced application engineers, the demo center also provides process development and prototyping services. 
MRSI to present at the 20th Infostone Optical Communication Market and Technology Conference (IFOC) 
Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems will present “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone Optical Communication Market and Technology Conference (IFOC) in Shenzhen, China. The Conference will be held at Hilton Hotel, Shenzhen International Convention and Exhibition Center from August 30-31st, 2021. Learn more about the conference.
International Microwave Symposium
MRSI exhibited in Atlanta, GA for the first live show in the US this year. There were over 200 exhibits and great traffic at the MRSI booth. It was great to see everyone.

Dr. Limin Zhou presented on "Compound Semiconductor Chip - Bonding, Reliability, Challenges, and Solutions" at the IMS 2021 Virtual Show.
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MRSI-HVM FAMILY
1.5-MICRON DIE BONDERS
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1.5-MICRON DIE BONDERS
 MRSI Systems | 978-667-9449 | sales.mrsi@mycronic.com