MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 1-3, 2021. MRSI will be conducting live product demos of the MRSI-HVM die bonder with conveyor at MRSI’s booth #14B79.
The MRSI-HVM with a conveyor is specialized for tray-based applications such as die attach, passive UV lens attach, and in-situ UV curing. It is proven for its’ speed, zero-time tool change between dies, and <1.5 micron accuracy. The superior performance is enabled by dual heads, dual stages, integrated “on-the-fly” tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations. The MRSI-HVM offers manufacturers speed without sacrificing flexibility, precision or reliability.