Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China.
Contact MRSI to schedule a demonstration or learn more about our assembly solutions for advanced photonics applications.
MRSI will be demonstrating the MRSI-H-LD 1.5 micron die bonder at LASER World of PHOTONICS CHINA 2020. This machine is designed for high-volume manufacturing of advanced photonics devices, delivers industry-leading speed without sacrificing ultra-high precision and superior flexibility. These compelling value propositions ensure the Return on Investment is the best in the industry.
The system is capable of building of Chip-on-Carrier (CoC), Chip-on-Submount (CoS), Chip-on-Baseplate (CoB), passive lens attachment, and box packaging for customer’s products such as high-power laser diodes (HPLDs), AOC and other optical communication components, photonics sensors and silicon photonics components, as well as RF power amplifiers and Microwave devices.
