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Shear Mode Piezo Half-Rings and Bonded Whole-Rings!
Shear mode piezo half-rings are poled around the circumference of the ring (see red arrows). Epoxy silver electrodes are then applied to the top and bottom surfaces of the ring or to the outer and inner diameters of the ring (see blue surfaces). Alternative electrode materials can be considered upon customer request.
Why Shear Half-Rings?
- Increased sensitivity compared to parts poled in the standard-3 direction
- Easy assembly options
- Available in any APC Material
- Various electrode surfaces available
Looking for a little more excitement ?? Bond two shear half-rings for double the fun!! Together, two shear half-rings form a truly circumferentially poled shear ring !! APC can supply bonded shear rings in the material and size of your choice (within the constraints of EST) !
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Shear Half-Rings in two different
electrode configurations
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SHEAR MODE PLATES IN STOCK!
Four Standard Plates Available
APC International is pleased to offer shear mode piezo plates as a standard product. The shear mode plates are first poled in one direction. Following poling, APC's skilled staff remove our standard fired-on silver electrodes and re-electrode the piezoelectric ceramics along perpendicular axis using an epoxy silver or electroless nickel electrode.
Four Standard Shear Mode Plates are Available for Quick Delivery:
- 15mm x 15mm x 1mm - APC 850
- 15mm x 15mm x 1mm - APC 850 w/ wrap-around electrode
- 15mm x 15mm x 1mm - APC 840
- 15mm x 15mm x 1mm - APC 840 w/ wrap-around electrode
In addition to our standard plates, APC can also custom manufacture shear mode piezo plates specific to your needs.
Consider using APC shear mode plates in your next piezo application requiring increased displacement or greater sensitivity.
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The picture above is representative of APC's 15mm x 15mm x 1mm shear mode plates. The notches indicate the positive face of the ceramic (red arrow indicates the poling direction). Blue indicates epoxy silver. Note the wrap-around electrode for easier lead attachment.
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2017 IEEE International Ultrasonics Symposium
When: September 6-9, 2017
Where:
Omni Shoreham Hotel
Washington, D.C. USA
Event Info:
Organized by The American Ceramic Society, the event addresses emerging needs, opportunities and key challenges in the field of electronic materials and applications. Technical presentations highlight a
dvancements in materials and devices for electronics, sensors, energy generation and storage, photovoltaics, and LEDs. The event also features 11 comprehensive symposia, a special tutorial on thin films, and the always-popular session on learning from failure.
The conference appeals to an especially wide range of interest groups and an international
attendance of 1300 or more is anticipated.
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42nd International Conference and Expo on Advanced Ceramics and Composites
When: January 21-26, 2018
Where:
Daytona Beach, Fl USA
Event Info:
ICACC18 showcases cutting-edge research and product developments in advanced ceramics, armor ceramics, solid oxide fuel cells, ceramic coatings, bioceramics, and more. The technical program and Industry Expo provides an open forum for scientists, researchers, engineers, and industry leaders from around the world to present and exchange findings on recent advances in ceramic science and technology.
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