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Lantronix New SIP Modules Deliver Powerful Performance, Vivid Graphics, Dynamic Camera Capabilities & Broad Connectivity Options

Lantronix expands its Open-Q™ family with the new entry-level Open-Q 2290CS and mid-tier Open-Q 4290CS System-in-Package (SIP) chipset modules as well as the companion Open-Q AL2 Development Kit. The two SIP modules are footprint compatible, allowing for flexibility in hardware design choice. The Open-Q 2290CS SIP module (35mm x 35mm) is ideal for the development of industrial IoT applications and safety vehicle equipment control. The Open-Q 44290CS is an affordable, compact (36mm x 36mm), production-ready SIP chipset module that can power applications requiring AI intelligence and machine learning. The Open-Q AL2 Development Kit supports both SIP modules for rapid prototyping of innovative new products. The SIP modules are based on the Qualcomm® QCS2290 and QCS4290 System-on-Chip (SoC), utilizing Qualcomm Technologies’ heterogenous compute expertise with multiple specialized processing cores.

Open-Q™ 2290 Series SIP Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. Scalable volume deployment through future ConsoleFlow™ support for device management, zero-touch provisioning and OTA updates of functionality and security Secure compute platform Long device life cycle Open-Q™ 4290 Series SIP Compact SIP with Qualcomm QCS4290 SoC, 8-core 2.0/1.8 GHz processor 3rd generation Qualcomm AI Engine Vivid graphics with Qualcomm Adreno 610 GPU Multiple high speed connectivity options Up to 6GB LPDDR4 and 256GB eMMC

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TQ Embedded SOM Family Offers i.MX8 Nano and Mini Technologies for Low-Cost Industrial Strength Cameras with Scalable Processing Options TQ Embedded, known for their precision engineered, industrial strength SOMs and solutions, first-in-class technical support, and their in-house process for true long-life availability - offers a SOM family designed to utilize any of the NINE NXP i.MX8 Nano and Mini processor variants. Three standard options of the TQMa8MxML offer scalability with single, dual, and quad Arm® Cortex® A53 cores. These CPUs are complemented by an Arm® Cortex®-M4 controller for security and real-time performance. MIPI-DSI and MIPI-CSI 2 interfaces and a small footprint make the TQMa8MxML a good choice for the core of a cost-effective industrial camera solution. TQMa8MxML Key Features i.MX8 Processor: choices of single, dual, quad cores: Arm® Cortex® A53 Camera/Video interfaces: MIPI-CSI 2, DSI (4 lanes each) Rich set of communications and peripherals: 2x USB 2.0 OTG, USB 2.0 Host, 10/100/1000 Ethernet, PCIe 2.0 Multiple UARTs, I2C, SPI, QSPI, SDIO/eMMC and audio RTC, Temp sensor GPU, Mini configurations have video encode/decode (not in Nano) OS: Linux, Android on request Extended Temp Range available (-40 to 85C) Small form factor: 38mm x 38mm Low power: 4 watts typical True long-life availability Baseboard kits available – Industrial strength

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Intel® Agilex® 5 Custom AI-enabled Cameras The Intel® Agilex® 5 family of FPGAs extends the innovations of the Agilex® FPGA to a broad range of midrange applications that require high performance, lower power, smaller packages, and lower logic densities. Fabricated using Intel 7 process technology, the Agilex® 5 FPGAs feature 2nd generation Hyperflex™ interconnects, heterogenous ARM v8.2 multicore processor system, enhanced DSP with AI Tensor blocks, and a MIPI D-PHY v2.5 interface. Agilex® 5 FPGA devices are manufactured and packaged with Intel’s own resources to mitigate supply chain issues. The integrated MIPI D-PHY IP supports data rates up to 3.5Gbps per lane in 1, 2, 4 or 8 multi-lane configurations without requiring external components. This D-PHY IP’s transmit interface supports DSI-2 v2.0 interface up to 4 lanes for video displays and receive interface supports CSI-2 v3.0 up to 8 lanes for high-resolution image sensors. Using the AI Tensor blocks, advanced user-implemented AI image processing algorithms can be applied to the video stream from the sensor before transmission to a display or to an extensive set of secure connectivity interfaces.  Intel® Agilex™ 5 FPGA Key Features

E-Series (formerly codenamed Sundance Mesa) Optimized for power and size-Ideal for intelligent applications at the edge, embedded, and more 50K - 656K LEs Package size as small as 15 mm x 15 mm Up to 24 x 28G transceivers Up to PCIe 4.0 x4 and 10/25GbE x6 Hard IP DDR4 @ 2,667 Mbps, DDR5 @ 3,600 Mbps, LPDDR4/5 @ 3,733 Mbps Peak TOPS INT8 up to 26 18x19 Multipliers up to 1,692 Multi-core Arm processors of Dual-core A55 @ 1.5 GHz and Dual-core A76 @ 1.8GHz MIPI D-PHY v2.5 at up to 3.5 Gbps per lane D-Series Optimized for performance and power efficiency - Ideal for various applications across multiple markets 103K - 644K LEs Package size as small as 23 mm x 23 mm Up to 32 x 28G transceivers Up to PCIe 4.0 x8 and 25GbE x16 Hard IP DDR4 @ 3,200 Mbps, DDR5 @ 4,000 Mbps, LPDDR4/4x/5 @ 4,267 Mbps, QDR IV @ 2,132 Mbps Peak TOPS INT8 up to 56 18x19 Multipliers up to3,680 Multi-core Arm processors of Dual-core A55 @ 1.5 GHz and Dual-core A76 @ 1.8GHz MIPI D-PHY v2.5 at up to 3.5 Gbps per lane

Target Applications AI-enabled Security Cameras Video and Image Processing Wired and Wireless Communications Industrial and Medical Electronics Ask our Intel experts at Macnica for details on the all-new Intel Agilex FPGA families coming out this year!

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About Macnica Americas Macnica Americas, Inc. is the North America division of Macnica Fuji Electronics Holdings, Inc., a $7.5B global leader in technology product distribution, technical support, and design services. To sign up for our monthly newsletter, please click here .  For other inquiries, contact us here .