This event will be held from December 7-9th at the Shenzhen World Exhibition and Convention center. We will be showcasing our family of die bonders and our latest product releases targeting our fast-growing markets of aerospace & defense, medical, datacom and emerging technologies including high performance laser diodes and LiDAR. Using case studies across our many markets we will be discussing how our decades of successfully installed systems and innovation continue to satisfy our customers’ requirements regarding reliability, high speed, flexibility and high precision.
MRSI will be providing live product demos of the recently launched MRSI-H-HPLD+ along with various assembly technologies and solutions with detailed insights. The MRSI-H-HPLD+ is the latest advancement in the MRSI-H/HVM series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility.
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