CELEBRATING OUR 4TH YEAR OF PUMANEWS™ |
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As I See It!
Strengthening Our Company by Empowering Our Teammates
SEPTEMBER 2022
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For this month’s PumaNews™, I’d like to expand on the article by Jason Shuppert, Insulectro Vice President of Operations & Supply Change. Jason’s article is entitled: “Engaged People, Solving Problems.”
These four words accurately sum up what Insulectro does constantly on the “backend,” out of the view of our customers. As Jason notes, he uses his operations team to simulate obstacles and problem solve solutions to make Insulectro more effective, starting with the front line.
We are totally focused on the continual improvement of all of our processes – from Operations to IT, from Sales to Product Management. However diverse these processes, they are all united with one goal – we want to help you make your business stronger and more profitable.
Throughout this issue, you will see other examples of continual improvement similar to Jason's.
By being lean, mean, and agile, we build upon our goal of being the easiest company to do business with.
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PCBAA, the Printed Circuit Board Association of America, welcomes their newest members: DuPont and Nano Dimension.
Existing members include AGY, Amphenol, Bowman, Calumet, Insulectro, Isola, Summit Interconnect, TTM Technologies, Denkai America, MacDermid Alpha, Nano Dimension, Pacothane Technologies, Sanmina, Uyemura, and Rogers Corporation.
The Printed Circuit Board Association of America is a consortium of companies, representatives, and enthusiasts who are advocating for U.S. manufacture of printed circuit boards.
Insulectro is proud to support PCBAA's effort as a founding member.
We encourage you to not stand on the sidelines but get involved to support PCBAA's three main objectives:
- Support the Domestic Production of PCBs
- Enhance Domestic Supply Chain Security
- Advocate for Initiatives that Create Fair Market Conditions
This organization is your voice in Washington.
Visit PCBAA.org today to learn more about membership. See below for more information and a link to inquire about membership.
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PCBAA LEADERSHIP SPEAKS OUT |
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Success Story!
Teamwork & Problem-solving
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"Thank you, you and your people really came through for us yesterday. I do appreciate it."
Buyer
The Backstory from Insulectro's Brandon Heller: A fabricator recently had a need for 700 pcs of 370HR laminate and prepregs.
They told TAM Mike Freebery that whoever had the material would get the order.
Insulectro was able to deliver. Pete and the team in Bloomingdale cut the stock we had there for the fab to pick up at 6 pm - same day.
Alberto and team in San Jose were able to get 300 pcs cut and shipped out overnight. The rest followed the next day. Without everyone’s help in Ops this would have not have happened.
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What Happens Next!
The Supporting American Printed Circuit Boards Act Is Law
I-Connect007's Nolan Johnson Interviews PCBAA's President Will Marsh (TTM Technologies)
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Now that the CHIPS Act has become law, Nolan Johnson reconnects with PCBAA President Will Marsh to ask the question: What now? Will brings Nolan up to speed on the initial stages of implementation and administration, and provides more insight on the Supporting American Printed Circuit Boards Act of 2022.
Nolan Johnson: Hi, Nolan Johnson here with I-Connect007. I’m speaking with Will Marsh, vice president of government relations at TTM Technologies and the president of the PCBAA. Will, thanks for joining me.
Will Marsh: Thanks for your time today, Nolan. Honored to be here.
Johnson: Now, we are talking because there has been some industry specific legislation passed through not only Congress, but also signed by the president of the United States. We now have the CHIPS Act in process and that’s big news.
Marsh: We completely agree with you. We’re ecstatic that Congress and the president have been able to sign this initial piece of legislation that is going to address some economic and national security concerns that we see in the microelectronics ecosystem.
Johnson: Now that we’re into the implementation of rollout phase, what’s next?
Marsh: That’s probably the $64 million and/or the $52 million question in Washington, DC. What we know, Nolan, is that now the Department of Commerce is chartered with qualifying and distributing $52 billion to the domestic industry, primarily led by the semiconductor industry.
About $2 billion of that $52 billion is going to be used for advanced packaging within the Department of Defense and the Department of Commerce for industry advancements. But the big question remains: How is it going to unfold? What are the protocols going to look like? This, in my understanding, is the largest distribution of funding by the Department of Commerce, per one piece of legislation.
This is unchartered territory for the Department of Commerce. This is a big chunk of money. But at the end of the day, the reality is the companies that are competing for this, this CHIPS Act money, you can spend through $50 billion in a matter of a few hours with a handful of primes, right? From the Intels of the world, etc.
So, we consider this a down payment, like many are starting to say. Just compared to what the foreign countries are investing in their semiconductor operations. But the unknown is the timing on Department of Commerce distribution of said funding.
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SALES & OPERATIONS MANAGEMENT |
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Ken Parent Speaks Out!
Staying Ahead of Uncertainty
SEPTEMBER 2022
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Name 3 Things that are certain in life: Death, taxes, PCB Business consolidation.
What is not certain is how consolidation will impact me and you. But, are there things we can control so that when consolidations happen they will have a positive outcome for you and me? That is our collective challenge.
At Insulectro, I find myself still digging deep to understand the market and make sure we have the right materials in the right place at the right time.
We are investing many hours and dollars into learning:
- What are the best tools to predict and monitor future needs?
- Which people know the most about future needs?
- What technology will feed the uptick in demand when the OEMs start to buy more PCBs and want them delivered faster?
With that said, I expect all of our Insulectro customer-facing teammates to have daily conversations with the most informed people at our customers about the future needs of the PCB Fabricators and OEMs.
Please help us help you.
Share what you know with our Technical Account Managers, Inside Sales Managers, and Product Managers. Tell us what you see happening in the market that you would be willing to bet on.
This information is gold right now. The supply chains continue to be constrained on multiple fronts, so getting ahead of the curve with good data and commitments will make all of our businesses more profitable.
Thank you for your help in predicting and creating a more stable future in this consolidating market we are living in.
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Ken Parent
Chief Operating Officer
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Livin' in a Material World!
Supporting Each Other,
Supporting Our Industry
SEPTEMBER 2022
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I recently had the opportunity to join a group of ladies from Summit Interconnect and APCT in a local mixer organized by Richeal Klepach, formerly with Summit, for the purpose of getting to know other women in the Electronics Industry, and to be part of a community that supports collaboration, provides positive support, and career inspiration for each other.
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Pictured:Michelle Walsh; from Summit: Erika James, Audrey Whiteside, Theresa Raissdana, from APCT: Jettie McCartney, and Kathy McLaughlin, and Richeal Klepach |
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It was a lot of fun to share experiences with a group that spans from one year to decades (I wasn’t the only one-lol) working in the PCB fabricator industry. I am glad to see the increase of women working in the Electronics Industry, which will continue to bring the benefits of diverse thinking to our businesses.
Reflecting on my own PCB career history, I’m grateful for the knowledge the industry “experts” shared with me, both customers and my employers. Most of the learning was through observing others and listening to stories of “how it’s done” and “how I got here”. I was also fortunate to be able to travel the country to support many different customers and observe ways to run each process, help establish best practices, develop them through designed experiment results, and then share them with others.
Insulectro is investing in sharing our experiences and expertise through teaching the next generation of talent and contribute to the growth of our industry for years to come. With technology changes, we need to continue to learn from each other, leverage the knowledge of the industry experienced veterans, and the driven, creative thinking, eager talent ready to propel this industry forward.
One thing that has not changed since I started in this industry, is the benefit of networking and building relationships within the industry. Thank you again Richeal for taking the lead in making these valuable connections.
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Michelle Walsh
Vice President of Product Management
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DuPont Inks Become Micromax™ Inks
DuPont Launches Micromax™ Brand for Microcircuit and Component Materials Products
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Wilmington, DE. Sept. 13, 2022 – DuPont announced today the launch of a new brand, Micromax™, that will encompass the products formerly known under Microcircuit and Component Materials. Micromax™ products are used in a wide variety of electronic applications, from automotive, passive components, and 5G communications to healthcare and consumer goods.
“Micromax™ aims to be the leading brand for electronic thick film inks, pastes, and ceramic tapes,” said Tim Chang, Micromax Global Business Leader. “The new brand name won’t impact on our offerings or how we work with customers - high-quality products, exceptional customer service, and broad-based expertise remain the same – it will simply be faster and easier to identify our offerings.”
Micromax™ serves to organize nearly 800 products under a single cohesive brand and simplify how distributors and customers identify and specify their preferred products. The change includes:
· GreenTape™, which will now be known as Micromax™ GreenTape™
· Heatel™, which becomes Micromax™ Heatel™
· Intexar™ which becomes Micromax™ Intexar™
· Fodel™ which becomes Micromax™ Fodel™
Micromax™ products enable extremely customized solutions because they are tailored in close partnership with clients to deliver the desired solution. With extensive knowledge of materials science and a breadth of electronics experience, the Micromax™ team helps customers imagine what others don’t, test what others can’t, and deliver true innovation that can positively change markets and improve our world.
About Micromax™
Micromax™ is a leading brand of printable, stretchable, and moldable functional thick film inks, pastes and ceramic tapes. Micromax™ brand products are utilized for circuitry, interconnection and packaging of electronic devices in automotive, passive components, telecom, consumer electronics, healthcare and military applications featuring properties such as enhanced circuit density, improved thermal management, higher reliability and other critical functionality. Micromax™ represents over 60 years of experience in the development, manufacture and sale of specialized electronic materials, and offers leading global customer support and product quality and consistency.
To learn more about Micromax™ please visit Micromax™ by clicking link below.
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Emerging Manufacturing Engineer
RJ Feliciano
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RJ Feliciano is a recent Spring 2021 mechanical engineering graduate from UC Irvine! His undergraduate career focused on robotics, mechanical design, fluid dynamics, and autonomous systems. Prior to joining Insulectro in a new position of Emerging Manufacturing Engineer, RJ held positions at Tecan and Global ASR Consulting. RJ is based in Southern California and reports to Geoff Leeds, Product Manager - Flex Laminates.
As RJ puts it: "I feel very fortunate and excited to be able to apply the skillset I’ve honed in pursuing my bachelor’s degree in the PCB industry, a branch of materials science that I have great passion in. I am thrilled to work with the team in implementing new designs and improvements in the PCB manufacturing process, particularly with achieving industry 4.0. It feels great to know that what I will be doing will impact the industry, even by a tiny margin!
"Insulectro is a collection of team players that are experts in what they do. Everyone that I’ve met has been very knowledgeable and dependable. They believe in the values of continuous improvement and collaborative effort, which is exactly the group of people I want to surround myself with!" RJ concluded.
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OPERATIONS & SUPPLY CHAIN
WORLD-CLASS MANUFACTURING
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WCM: Engaged People, Solving Problems
SMALL REVERSIBLE EXPERIMENTS
SEPTEMBER 2022
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DATELINE: LONDONDERRY, NH |
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One of the most fulfilling components of the World Class Manufacturing (WCM) framework to witness in action is Employee Involvement.
With our focus on growing our WCM Culture, we have been deliberate about ensuring that we are both encouraging our teammates to “make problems visible” and giving the people doing the work the first crack at solving them.
A couple of “Kaizen” events, or as we also like to call them “Small Reversible Experiments” (from what we have learned from our friends at SEL - Schweitzer Engineering Labs), have been initiated recently, and highlight this engagement and how we are empowering our teams.
First, in our Londonderry, New Hampshire facility, the team has been battling curling issues on Teflon with differences between hot summer temperatures in our dry warehouse storage as compared to our “cold” converting clean rooms. Mark Jones, Tina Boissonneau, and Gabriel Zapata worked to devise a plan to relocate some of our thin Teflon products to cold room storage 24 hours prior to being converted, which has resulted in a significant improvement in converting performance.
We are following a standard Kaizen “Before & After” template to tell the stories of these events and below is the summary of the team’s efforts on this project:
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Great work Londonderry team! You are doing a great job-making problems visible and driving action!
DATELINE: LAKE FOREST, CA
Meanwhile, out in our CAC Manufacturing Operation in Lake Forest, CA, we also are using the Kaizen/”SRE” process to address yield loss/waste. Brandon Miller (Senior Process Engineer) Felix Martinez (Director of Operations) and the entire CAC manufacturing team (special thanks to Mike Reyes for your leadership in this process!) kicked off a 4-Step problem-solving session last month to get after this.
Key questions to answer as part of the 4-Step Problem Solving process are:
1) What is Happening? What Should Be Happening? What is the Impact?
2) Do I Know the Cause?
3) Have I Confirmed the Cause & Effect?
4) Have I Confirmed the Countermeasures?
The team did a “Go & See” “Gemba” walk, and spent several hours evaluating the end-to-end process, mapping out potential causes (Man, Method, Machine, Material) using an Ishikawa (or “Fishbone”), “Cause & Effect” diagram.
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We then went through each potential cause and had the operators weigh in on their thoughts on what items would be the highest impact and lowest effort to make improvements.
That narrowed the focus of what the team is going after, which includes production scheduling efficiencies, materials consistency and performance, simple visual set-up standards for training, and tool enhancements for easy set-up/web control.
Look for a “Before & After” in the coming issues of PUMANEWS™ to highlight the progress being made by this team!
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What an inspiring experience to be on the ground floor of watching our WCM culture take shape, and our operators feeling empowered and engaged as the lifeblood of process improvement/problem resolution!
Engaged People, Working Safely, Living Our Values, in a WCM/Lean Culture.
This is the mission statement of our Operations Team, and we are truly starting to live this every day!
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And thanks to everyone for another remarkable month.
Jason Shuppert
Vice President of Operations
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Let's Catch You Up!
IPC Has Updated Some Standards
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IPC develops the most widely used standards that convey and clarify expectations for everyone in the electronics business, ensuring the highest quality, consistency, and dependability in electronics design, fabrication, and testing.
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With hundreds of IPC standards, it can be difficult to keep up with all of the revision and appendix changes, which is why I spoke with a few IPC committee members to learn what standard updates they are working on and why they believe these updates are important.
IPC-4562 (Metal Foil for Printed Board Applications) - The next revision being released around the end of this year covers lower profile foils and thinner foils for the next generation high speed digital (HSD) and radio frequency (RF) applications. This is important because OEMs will need to update their specifications to reflect the best material selection for their upcoming designs.
IPC-6012 (Qualification and Performance Specification for Rigid Printed Boards) – The next revision will include board cavity and edge plating acceptance criteria. Currently there is no design guide or performance specification, which makes acceptance criteria AABUS (as agreed between user and supplier). Expect criteria on edge plating conditions such as copper thickness, blistering, and imperfections. Cavities will now have different classifications and criteria on conditions such as bleed out and pullback.
IPC-2228 (Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards) – This BRAND-NEW document has been in the works for 4 years and will be published soon! Board designers will now have an industry standard to help ensure the designed features perform as intended on the final product. This design standard supports the existing IPC-6018 Qualification and Performance Specification for High Frequency Printed Boards.
What better way to illustrate the value of working together in this industry than by collaborating with an electronic materials supplier, a printed board manufacturer, and a DoD contractor to bring you some important IPC standard updates that impact all of us?
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Laura Martin
Director of Technology
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Tools at a Glance
End Mills and Routers and Drills, Oh My!
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Insulectro is proud to be the newly signed exclusive North American distributor for Kyocera PCB products. Kyocera has a full line of products to support customer needs in both the drill and fabrication areas.
Highlighted in this newsletter are the multiple end mill series available to support all ranges of technology and are ideally suited to meet the quality needs and challenges seen in the drill and fabrication rooms today.
Below is a list of the end mill series stocked and available at Insulectro to support our customers as they strive to provide outstanding quality to their customers.
End Mills
- Series 1500 – Single Flute End Mills (Soft Materials)
- Series 1560 – Single Flute End Mills (Flex Laminates)
- Series 1600 – 2-Flute End Mills (Std Materials, Slots, PTFE)
- Series 1660 – 2-Flute End Mills (Flex Laminates)
- Series 1730 – 3-Flute Zero Helix, No End Style, End Mills
- Series 1735 – 3-Flute Zero Helix End Mills
- Series 1800 – 4-Flute End Mills
Have a challenging process issue? Reach out to us today and we will work with your team to provide a solution!
Kyocera is unique in the North American market as they alone can design, develop, and manufacture drills, routers, and endmills for specialty applications, quick turn requirements, and bring new designs faster to ever-changing market needs all right here in Orange, California USA. Along with our industry-leading backer and entry products, Insulectro has what you need to build better boards faster.
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Along with our industry leading backer and entry products from LCOA®, Insulectro has what you need to build better boards faster.
Please contact me for additional information, technical support, or process related questions. Our Insulectro team looks forward to assisting in you!
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Geraldine Arseneau
Product Manager - Kyocera Precision Cutting Tools
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InduBond® has the technology and performance in many areas of their equipment lines.
They also have industry-leading cost savings as well to reach the ROI even faster! The total footprint of this unit is more manageable.
For those of you who are worried about where you would put such a massive conventional press, look no more!
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Track your every move and what your press cycle is doing in real time!
Endless recipes for any material configuration including high temperature and pressure capabilities for all your hi-tech materials.
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Automation is not Automatic!
UCE - Universal PCB Equipment Co LTD
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We have the machine to fit your needs with a proven track record of quality, performance and durability!
Lines include:
- Plating lines
- DES – With Hyper Etch Technology
- SES – With Hyper Etch Technology
- Immersion Silver/Tin
- OSP
- Desmear/PTH
- Scrubbing lines – Debur/Pumice/Jet
- Handling equipment
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Please reach out should you like to discuss our equipment offerings further. |
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Thank you.
Kevin Barrett,
Product Manager - Equipment
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Geoff shouts: "Failure is not an option!"
Designed with Reliability in Mind, Flexible in Nature
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Pyralux® AP Flexible Copper Clad Laminate (FCCL) is best in class for any Rigid-Flex, pure Flex or Hybrid design.
Pyralux® AP FCCL are in every market and application where success is not just needed but required. Low Earth Orbit (LEO) satellites exposed to Atomic Oxygen plasma, down-well oil and gas electronics requiring elevated operating temperatures or military hardware that can’t fail – Pyralux® AP laminates are proven in each environment to deliver. If you are ever stuck trying to pick which FCCL to use, Pyralux® AP won’t let you down.
Pyralux® AP laminates work best when paired with the right flexible adhesives. Each application listed above uses different Adhesive Systems (AS) to ensure success.
Here are some great combos:
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UL Flame Rating requirements? Pyralux® AP FCCL + Pyralux® FR acrylic adhesive.
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Space born application? Pyralux® AP FCCL + Pyralux® LF acrylic or Pyralux® HT polyimide bondfilm.
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High speed designs? Pyralux AP® FCCL + Pyralux® HP low loss epoxy adhesive.
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Underhood or near a high temperature rocket booster? Pyralux® AP FCCL + Pyralux® HT polyimide bondfilm.
No other IPC- 4204/11 certified material comes close to the flexibility that Pyralux® AP FCCL brings to your designs. With utilization in almost every sector, Pyralux® AP and Pyralux® adhesives are a match engineered to succeed. No matter the environment.
Want some one-on-one support? Reach out, were happy to help.
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Geoff Leeds
Product Manager, DuPont Flex Laminates
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PRINTED ELECTRONICS INKS & PASTES,
SUBSTRATES & FILMS
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Kevin Miller Can See it!
DuPont Invites Insulectro to BMW Championship
SEPTEMBER 2022
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Insulectro Printed Electronics Team recently attended the BMW championship in Wilmington Delaware with our partner DuPont MCM group. We had the opportunity to attend the DuPont hospitality suite and walk the course and see the players compete for the FedEx cup.
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Left to Right: Daniel Barish, DuPont MCM; Tom Bianchi, Eastprint; Bob Lee, Insulectro |
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We had customers from the printed electronics accompany us and the event was a great success. We followed some great golfers like Rory Mcllroy, Scotty Scheffler, Patrick Cantlay, Jordan Spieth and Jon Rahm to name a few.
The weather was hot and humid but what a fun time plus the accommodations were incredible. At the end it came down to Patrick Cantlay winning the event as we watch them play and as we were seated at the 17th hole.
The FedEx Cup Playoffs, one of the world’s finest tournaments, came to Wilmington for the first time. The 2022 BMW Championship was played on Wilmington Country Club’s East Course, from August 16-21.
This course is set among the rolling hills of the Delaware Valley and surrounded by land formally owned by the DuPont family, the storied history of 120 years has solidified the Wilmington Country clubs as the most prestigious club in the country.
At the penultimate playoff event, the top 70 golfers on the PGA TOUR competed to qualify for the season finale. Introduced in 2007, the BMW Championship was previously known as the Western Open. The Western Golf Association, which founded and ran the Western Open, runs the BMW Championship.
World-class golf and extreme tension were present. All proceeds from the BMW Championship benefit the Evans Scholars Foundation.
Thank you, DuPont, for hosting a such great event!
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PE Customers Interviewed for
Design007 Magazine (Part 2)
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The second in a series of three articles for Design007 magazine on printed electronics and flex circuits. Kevin Miller VP of Sales was interviewed by I-CONNECT007's Andy Shaughnessy along with three Insulectro customers. |
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Use the link below to access the article. The interview concluded with this quip from Eastprint's Tom Bianchi: |
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Please call INSULECTRO at 1-855-955-0200 with any questions regarding these product offerings or visit our E-Commerce site at the LINK BELOW.
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Kevin Miller
VP of Sales - Insulectro Printed Electronics
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Chris Hunrath on Future Tech
Thermoplastics Use in PCBs
SEPTEMBER 2022
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With few exceptions, PCBs use metallic solder to attach components electrically and mechanically. This works so well, the industry has devoted much research on solder interconnects, PCB thermal reliability and solderable finishes.
Even as the world looks for the elimination of lead, this has not changed. PCB materials had to evolve to handle the higher solder melting points and reflow temperatures. Most common are phenolic cure epoxies that handle the extra heat with relatively low cost.
Low-loss dielectric materials are another aspect of PCB technology. More specifically materials that absorb less of the signal energy in high-speed or antenna applications.
Some of the lowest loss materials are thermoplastic polymers. These differ from the thermoset variety like epoxies in they can re-melt when heated. This means that if their melting point is near that of solder reflow, they are not suitable as a PCB dielectric.
There are some with both low signal loss and high melting points. Here are a few which have been used in the industry.
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These materials, along with some others require different processing than the more traditional thermoplastics. Laminating, drilling, desmear, and plating all require some special attention.
From an equipment standpoint, Lamination can be the most challenging. Both the equipment and the press book materials must be capable of 550 °F at a minimum.
This is an area where we can help. We can provide training as well as laminating materials for successful high-temperature thermoplastic PCBs. If requirements for working with these materials come up, please let us know.
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Chris Hunrath
Vice President of Technology & Vice President of Sales - Western Region
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Puma Friend Judy Warner!
Meet the EEcosystem
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In April 2022, I decided to take a leap of faith and launch my own company and The EEcosystem Podcast My vision is to create a source of technical content, community, and resources for EEs and design engineers that are developing high-speed and high-frequency applications.
The tagline for The EEcosystem is Educate, Connect and Equip–which I believe are the three greatest needs of busy engineers today (besides more time and budget!) My goal is to help build bridges between engineers, the industry, and fellow stakeholders in the design and development process.
As I see it, it takes far more than a village to bring up a board or system–it takes a complex interconnected ecosystem and one which is continually evolving.
Since the podcast launch in May we’ve launched two new EEcosystem resources: The EEcosystem Master Class Series and The EEcosystem online Discord Channel. The feedback and support of engineers and of the industry have been overwhelmingly positive. Our sponsors now include: Signal Integrity Journal, Keysight Technologies, Samtec, Siglent, Summit Interconnect Technologies, Picotest, and Transline Technology–all of which share our mission and vision for education and engineering support.
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Our first Master Class, Transmission Lines 101 with Prof. Dr. Eric Bogatin, will be presented “live” online September 29-30th. This is a paid professional development course. Registration is open through September 28th. For PumaNews™ readers use the promo code PUMA to get $100.00 off.
The EEcosystem Discord Channel is open and free. Our expert podcast guests have a dedicated thread where you can ask your burning technical questions or just network with other engineers and industry experts and professionals.
I hope you’ve enjoyed learning more about The EEcosytem.
Since you are an integral part of the electronics Ecosystem, I'd like to extend an invitation to join the Ecosystem Community. You can do that by simply subscribing to our monthly newsletter.
You can also subscribe to our YouTube and Podbean channel (or on any of your favorite podcast apps). Next weeks' podcast will feature Rick Hartley talking about his presentations at PCB West.
Wishing you and the entire PumaNews™ community continued success. I hope to see you and the Insulectro team at the upcoming PCB West Exhibition in Santa Clara on Oct. 4th. Meanwhile, please connect with me on LinkedIn. I’d love to connect and hear from you!
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Judy Warner
Principal and Founder
The Ecosystem Podcast &
Impact Technology Marketing
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Riston® DI3000 Dry Film
Eliminate Donut Adhesion Issues
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Riston® DI3000 dryfilm is the next generation print and plate dryfilm. This is a dual wavelength film that is optimized for use on today’s direct imaging systems. This film delivers great resolution and optimal adhesion of small features like donuts and thermal reliefs, even on flash plated foil.
It is available in 38, 50, and 62 micron thickness.
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Please contact me or your local Insulectro TAM. |
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Jeff Johnson
Product Manager - Dryfilm/Chemistry/Paste & FAE
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Getting to Know
the Midwest
(CHICAGOLAND) It’s that time of the year again and our annual CCBA Golf is this week. My fifth event!
Wow six and half years ago I started working for at Insulectro and how things have changed. Trey is moved on now, others as well, but we will always have the opportunity to laugh and reminisce about our time together at Insulectro, at the annual CCBA tourney and Insulectro’ s Social at Venuti’s Italian Restaurant the night before the tournament.
Here in the Midwest, we take our golf seriously, but CCBA week is one week where golf fanatics, and even those who do not golf, get to take a moment to sit back and smell the roses. Although I don’t believe there are any roses at Kline Creek Golf Club, we all do get a chance to get away from the supply issues, the manpower shortage, contaminated bath and registration issues.
For 36 hours we all can just be friends and wonder who is going to win that Yeti cooler.
Yeti cooler? Yes, the elusive Yeti cooler. For years I’ve told my friends, Dave Coppens, Dave Kemper, and Trey how much I wanted to win the Yeti cooler in the raffle, but who wins the Yeti? Dave Coppens, Dave Kemper, and Trey. Maybe this year will be my year, but even if it’s not the Yeti or one of the other great prizes given away each year, I will be able to say a bad day on the golf course with friends is, well you know.
It may be cliché, but the Midwest has some of the best people in the industry, and where better to meet and spend time with them, than at a Happy Hour followed by a day of golf at our annual CCBA Golf Tournament? If you’re not signed up yet, you should! FORE. . .
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Mike Freebery
Technical Account Manager
Midwest Region
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(TWIN CITIES) Hard to believe another summer has zipped by. Labor Day and the Minnesota State Fair have come and gone. As we roll towards Winter, or as our shipping department likes to call it “freeze protect season”, we are still faced with many ongoing challenges. At the top of the list is an extremely low unemployment rate and subsequent supply chain issues.
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Supply chains have never been particularly flexible or nimble, for several reasons, such as centralized inventory, patchwork trucking logistics, and limited visibility. Then add in unprecedented workforce shortages and E-commerce growth, and here we are.
With that said, I am truly impressed with the PCB shops we visit and support. Many are focused on working smarter and planning for the future. Including a merger, capital equipment investments, and recruiting fresh talent right out of college. Insulectro is doing the same and supporting our customers with even more quality materials and products., strong technical support, forecasting and stocking capabilities.
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Garret Shepard
Technical Account Manager
Midwest Region
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@Mike Creeden
Advanced Via Solutions (Part Three)
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Advanced circuit requirements are presenting new challenges every year. These challenges are driven by the ever-increasing need to be smaller, faster, accomplish more, be cheaper, and often must be accomplished quicker. So, each year we try to meet these needs by working smarter, faster, and more efficiently, adding technology and innovation. One of the most challenging features on our circuit boards is the vias by which we make Z-axis interconnects. Advanced challenges require advanced innovations. We will continue to take a look at the challenges that vias are facing in this next article.
Z-axis Interconnects called, Transient Liquid Phase Sintering (TLPS) materials, which is the use of copper sintering paste, i.e., Ormet® Paste Z-Interconnects, can be a very helpful alternative solution. This is an alloy compound of Copper (Cu), Tin (Sn), and Bismuth (Bi) as the binding agent.
- TLPS is processed at temperatures well below the final usable temperature limits, forms alloys that do not re-melt under lead-free reflow conditions
- TLPS establishes metallurgical connections with copper interfaces, maximizes electrical and thermal transfer with solderable adherents
- TLPS creates Z-axis interconnects during lamination, reduces lamination cycles
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Ormet® Sintering Pastes have been utilized in the industry for well over a decade. In fact, every reader of this article probably has these contained within the phone in your pocket or on almost every BGA interposer on your circuit boards. The current needs of everyday designs have now caught up to the advanced requirements used in telecom and BGA package designs with thin, high-layer count interposer boards.
Today’s circuit boards often contain extremely high-speed circuitry and the use of vias can cause unwanted radiating emissions from via stubs when a signal is routed on an inner layer but under a GND layer.
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Contact any of our Technical Account Managers or call any of our branch offices to schedule your Virtual Training Session soon.
Stay safe, happy, and healthy!
Mike Creeden CID+ MIT
Technical Director, Insulectro Design & Education
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PCBAA LEADERSHIP SPEAKS OUT |
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Welcome to the September Edition of Insulectro PumaNews™ Magazine - East Coast Edition…GSD ”Getting Stuff Done”
In July’s article, I talked about growing, 5 decades of strategic acquisitions, to support our customer in ways unprecedented in the PCB industry.
In this article, I want to talk about supply chain and customer intimacy.
You can’t talk about one without the other.
I realized that my knowledge of supply chain management was limited.
After many years at Insulectro it seemed as if we always had what our customers needed. It was nearly 100% rear-view looking, meaning what our customer bought last month is likely what they will by this month, so we the sales team entered a forecast that our planners purchased to month after month…until our customers stopped buying it, or needed to buy less of it or needed to buy more of it…
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To make sure I got it right I asked our Supply Chain Director, Montserrat Barcelo to co-author August’s article.
“Montse” as she is affectionately called, came to Insulectro with extensive knowledge of supply chain management and end-to-end customer order fulfillment.
In fact, Montse had worked side by side with Insulectro VP Supply Chain and Operations, Jason Shuppert, whom I can attest to has made a positive impact on Insulectro’ s business on many levels including operational excellence.
While it is often understood that the sales team establishes value across all stages of our customer journey, sometimes referred to as an “advanced form of customer-centric business.” It involves learning as much as possible about our customers.
The Pandemic as we all know added another layer of uncertainty and challenge to the entire “Global Supply Chain.”
No one escaped this black hole in the supply chain! Fortunately, Insulectro and our strategic, World Class suppliers were able to navigate this better than many. Our made-in-the-USA manufacturing position made a big difference.
But more work needs to be done to continuously improve our business and to have on the shelf what our customers need and deliver it when they need it.
For this reason, “customer intimacy” is the cornerstone to meet this goal and it must reach beyond just our customers, it needs to be influenced by our customers' customers and their customers. On the other side, also consider our suppliers and Operations teams, basically the entire supply chain.
Good supply chain decisions are driven by good data, and we achieve this goal through communication and collaboration.
Insulectro has several strategies on how supply chain and sales work together to develop a forward-looking demand plan with the goal of always exceeding our customers' expectations. Collaboration is our foundation: Sales has the relevant market insight and Materials the information on manufacturing needs. Together we work to focus on the exceptions that will add value to our overall planning process. All this is based on product segmentation, which is key to achieving exceptional service levels without excessive slow-moving inventories and write-offs.
Our mantra: Teamwork.
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Ron Murdock
Director of Sales - Eastern Region/ Canada
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PCBAA LEADERSHIP SPEAKS OUT |
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Isola Group Displays Materials for
Mixed-Signal Solutions at 2022 EuM
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Isola Group has long been a supplier of high-performance circuit materials for both high-frequency RF/microwave and high-speed-digital (HSD) circuits.
And, as visitors to the upcoming 2022 European Microwave (EuMW) Exhibition will find out, those different materials can be processed at the same temperatures and with similar manufacturing methods, making them ideal candidates for mixed-signal, hybrid circuits of the future, combining RF/microwave and digital circuits at the highest frequencies and speeds. These hybrid circuit solutions can be designed and manufactured as compact, multilayer circuit assemblies to fit the tightest space requirements while achieving the most challenging electrical, mechanical, and environmental requirements.
The 2022 EuMW Conference & Exhibition is scheduled for September 25-30, 2022, at the Milano Convention Centre in Milan, Italy, as part of European Microwave Week. Visitors to Milan can partake in state-of-the-art technical presentations, educational workshops, and an exhibition floor expected to draw thousands of potential customers.
Visitors to Booth F24 can learn about Isola Group’s line-up of high-performance circuit materials, including Astra® MT77, I-Tera® MT40, Tachyon® 100G, and TerraGreen® 400G.
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About Isola
Isola is a leading global material sciences company that designs, develops, manufactures and markets laminate materials used to fabricate advanced multilayer printed circuit boards, which provide the physical platforms for the semiconductors, passive components, and connection circuitry that power and control virtually all modern electronic products. Isola operates a network of factories worldwide.
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Norm Berry
Director, Laminates & OEM Marketing
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A Different Approach
Filling VIAs
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I’ve had several conversations with customers over the summer months regarding filling microvias reliably, and the challenges that the overall process presents. Most of these fabricators are using a button plate process to fill the vias and then planarizing the surface to address the inevitable overplating. One of the common discussion topics is what the planarization process does to the integrity of the filled via and what physical stress is inflicted upon the bond with the capture pad. Is there a better way is often a question.
Panel plating to fill microvias presents an opportunity to eliminate planarization and the extra process steps and unknowns that come with that mode of manufacturing. DuPont’s MICROFILL™ LVF-III is their latest technology to address this need. The objectives that guided this technology for sub-1:1 aspect ratio microvias include:
- 100% Fill
- Dimple on top of the microvia of less than 1.0 mil
- Plating thickness on the surface of the panel of less than 0.8 mils
- Thickness variation across the panel of less than 10%
- Plating time less than 5 hours
- Through-hole plating capability
DEEPER VIAS (5.7 mil deep x 6.3 mil wide – 0.7-0.9 mil surface copper)
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SHALLOW VIAS (3.6 mil deep x 4.7 mil wide – 0.8 mil surface copper) |
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The bottom-up filling mechanism is accomplished through a combination of factors & parameters:
- The functionality of the organic additive technologies in DuPont’s MICROFILL™ LVF-III chemistries
- The design & engineering of the electrolytic plating cell
- An understanding of fluid dynamics and the influence solution flow has on the filling mechanism
With the MICROFILL™ LVF-III system, planarization is eliminated and microvias are filled while surface copper thickness and distribution variation is minimized.
If you are looking for a different way to fill microvias and want to BUILD BETTER CIRCUITS, FASTER, contact me or your local Technical Account Manager to schedule a technology presentation.
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Paul Welter
Product Manager - Chemistry
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At-A-Glance
The DuPont Chemistry Line
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With the acquisition of East Coast Electronic Material Supply (ECEMS) in late March, Insulectro has brought another best-in-class product line to our customers. The addition of the DuPont Electronics Imaging & Interconnect Solutions (ICS) chemistry line, which was legacy Dow Chemicals before the Dow-DuPont merger, adds a complimentary piece to an already robust Insulectro product offering.
DuPont ICS is innovating new metallization technologies across many platforms:
Electroplating Applications
HDI
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Microfill™ EVF-III for advanced via filling and through-hole plating
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Microfill™ LVF-IV for next generation SLP applications
MLB
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Copper Gleam™ PPR-II for high aspect ratio pulse plating
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Electroposit™ EP-1600 for high aspect ratio DC plating
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Copper Gleam™ HS-200 for horizontal DC plating in FPC applications
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Copper Gleam™ ST-920 for DC vertical continuous plating (VCP)
IC Package Substrate
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Microfill™ SFP-II & Microfill™ LVF-IV for advanced SAP applications
Making Holes Conductive
Electroless Copper Solutions:
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Circuposit™ 3350-1 Vertical Electroless Copper
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Circuposit™ 4000 Horizontal electroless copper for FPC/RFPC
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Circuposit™ 6700 Horizontal Ionic Catalyst for Advanced HDI applications
Direct Metallization Solutions:
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Next Generation Crimson™ & Conductron™ palladium-based systems
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Next Generation Graphite 2000™ carbon-based system
ENIG:
Duraposit™ SMT-88 & Aurolectroless™ SMT 520
Process Chemistries:
DuPont offers a full line of cleaners, developers, strippers and other ancillary products to support printed circuit applications.
General Metal Finishing:
Full line engineering, decorative and precious metal offerings
As you can see, through this addition of the DuPont ICS chemistry line, Insulectro is now providing chemistry and technical support to the general metal finishing, plating-on-plastics, and wire plating industries, which we see as an area of growth.
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Ormet® PCB-710
Eliminate Lamination and Plating Steps
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Ormet® PCB-710 is a lead-free, copper-based, paste formulated for creating microvias in printed circuit boards. This can be done to replace stacked via designs with multiple lamination steps, or to bond subs together without requiring a through-hole drill to electrically connect the subs.
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The Ormet® paste is processed at normal PCB lamination temperatures. The final product offers superior thermal and electrical performance.
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For more information on Ormet®, please contact me. |
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Jeff Johnson
Product Manager - Dryfilm/Chemistry/Paste & FAE
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Coming in October!
PCB West: mSAP and HDI
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My colleague Mike Trammel of Summit Interconnect and I collaborated on a PCB West presentation. We will be co-presenting at the Santa Clara Convention Center October 4th at 10:00 am.
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Mike and I will combine our experience on Fabrication, Design for Manufacture and Material Science for mSAP and Ultra HDI PCB’s. Our hope is that this information helps make this technology more manufacturable in the larger PCB formats.
Come join us in Silicon Valley for PCB West and stop by the DuPont MCM and Insulectro Booth (#314).
To sign-up for the Insulectro Customer Portal, send an email with your Company name and Contact information to: portal@insulectro.com with the subject “Sign me up.”
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Chris Hunrath
Vice President of Technology &
Vice President of Sales - Western Region
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The summer has been relatively strong across our customer base. Most of our product lines have stayed in the green (positive growth) through a time when we typically see a slowdown during the months of July and August.
Rigid-flex customers have been especially strong, but rigid multilayer with Isola only has remained solid for the most part as well. Generally speaking, the word is that business will remain strong for the foreseeable future.
Supply chains globally are not improving which continues to put pressure on stocking capabilities. In Southern California, we are having more and more conversations with customers about forecasts and how we can work closer to capture more information on forward-looking demand guidance.
Ultimately, the more forward-looking demand information we can get from our customers the better position those customers will be in. From a product perspective, most lines are strong so it’s hard to highlight specific trends as better than others at the moment. However, there has been rising interest in lamination best practices including when and where to use the different Pacothane® products.
DuPont’s new DI5100 series resist is getting attention and showing advances in precision line width control and mSAP. The PM250 resist is seeing renewed popularity for use as a buffer film during planarizing after via fill. And lastly, Paul St. John has been getting busier in the region with more local calls to customers looking for training and process improvement ideas in the drill room.
As always, reach out to Pancho, Mike or myself if you need anything!
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Sean Redfern
Technical Account Manager - Southern California
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A Super Matchup!
Make Your InduBond® Press
Sit Up & Take Notice
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Bacon and eggs. Black and tan. Mac and cheese. Bert and Ernie. InduBond® and Copper-Steel-Copper!
Bonded Copper foil including VLP profiles onto a Steel carrier ensures that not only the low-profile topography is protected but the surface is clean, free from causing signal integrity defects as all FOUR edges are sealed. It's a star performer in an InduBond® press!
Carrier foil is available from 1µm up to 5µm, now CSC bridges that gap offering foils from 6µm to 140µm.
CSC is available in 8 mil which has twice the image transfer resistance as 15 mil aluminum AND can replace up to SEVEN standard 62 mil steel separators. Those separators not only cause circuit surface imperfections impacting trace lines but reduce stack height allowing more panels per lamination cycle.
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I've got a lot to tell you about this matchup!
Mark Satchwell
Product Manager, Foil & CAC®
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The People
Behind the Puma
Meet DAVID HEIEN
Focus Tech Operations Manager
Chandler, AZ
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BIO
I have been working Automated Chemical Solution / Focus Tech for the past 21 years. I started out working in the lab and doing production batches. I moved up to Lab / Purchasing manager. I worked closely with Scott Campbell to developing new products for the changing technologies in the PCB industry. I am currently the operations manager, but still oversee the lab, and work on sourcing and cost of our chemical raw materials.
David sees himself as a Swiss Army knife.
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When you were a little boy what did you want to be when you grew up? Marine Biologist
Are you more into food or convenience and why? I'd rather cook. I grew up with a lot of people that like to cook.
If you could change careers tomorrow and money was no object, what would you go do? Hunting Guide
Describe a time at work when you were at wit’s end. With all the sales allocation in 2021, finding enough raw materials to product the 14 full truckloads of finished products that we shipped to public storage to cover our shut down and move to our new facility.
Describe a time at work when you beamed with pride. When we got the new building set for the SEL tour and won the contract.
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If you were a tool, what would you be? A Swiss army knife. Multi-use and adaptable.
Who is a role model for you and why? My dad and A.D. Pallini (best friend’s father). They taught me work ethics, to always do the right thing, and look a person in the eyes upon greeting them.
What’s your go-to play vacation and why? Anywhere in the mountains because I can photograph nature.
If you suddenly inherited $10 million, name three things you would impulsively and three things you would take time to reflect over? Three impulses would be cabin in Montana, new 4-wheel drive truck, and family fishing trip in Alaska. Three reflections would be setting my kids up for a solid future, planning my wife and I’s 20 year anniversary, and a photography safari in Africa.
Name one thing you really don’t want anyone to know about you. I promise not to tell. . . I'm a socialized hermit and only talk to people because I have to.
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If you were a rock and roll singer, who would you be? Bob Segar or Eric Clapton.
What’s the perfect Netflix night for you? A cold Alaskan Amber and hunting shows.
What do you like most about your co-workers? Sense of family at Focus Tech.
What do you like most about your customers? They continue to work with us due to the quality and fact we've built long term relationships with them.
What advice would you tell a new teammate at your company? Always ask questions. No question is a stupid one, better safe than sorry.
What’s the last thing you’ll say on the day you leave the company? The mountains are calling and I must go!
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Most embarrassing vehicle? 1980 Chevrolet Chevette
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What actor would play you in a Hollywood biop? Jack Nicholson
What in your early life best prepared you for your job now? Observing my best friend's dad doing his work.
Name three traits that describe you. Loyal, sarcastic, punctual
How do you know when you’ve done a great job? Our customers are satisfied with our products and return.
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What has been the most embarrassing moment do far in your life. That time at my wedding when my wife tricked me during the garter toss and I ended up pulling it off my friend Donovan’s leg while blindfolded (see photo left).
How would you describe your sense of humor? Warped; I'm nermal not normal.
Wardrobe you now regret wearing? I lived through the 80's, nuff said.
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Is there anything you binge on? Food, movies, vacations, etc.? Hunting
Give some advice for your next boss. Always listen to employee concerns and own up to your mistakes. Lead by example.
Dream vehicle? Fully loaded RV to explore the country in.
If you were an animal, what would you be? A mountain goat.
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Contact your Insulectro or Isola sales representative for more information.
Norm Berry
Director of Laminates & OEM Marketing
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Join our
Puma Team!
Help us define the future of Printed Circuit Boards and Printed Electronics!
Join our Puma team and be a part of our growth.
Business Development
Operations
Pricing
Production
Warehouse
Others
Click on the ad (left) to see various positions we are recruiting.
As advertised in i-connect007's PCB Magazine
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Click-Out our
Pyralux® Flexible Laminates Selector Guide. . .
(click on product name)
The standard copper clad laminate systems for any flex or rigid flex designs.
The standard copper clad laminate systems for any flex or rigid flex designs.
Single sided flex copper clad substrate
Standard acrylic adhesives for building multi-layer flex designs. Offered as coverlay, sheet adhesives and bondplys.
Standard acrylic adhesives for building multi-layer flex designs. Offered as coverlay, sheet adhesives and bondplys.
An epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Offered as coverlay and sheet adhesive.
High temperature flexible adhesive system with an MOT of 225C.
Teflon®/Laminate system offered as a clad laminate or bondply. Ideal for RF designs.
Embedded resistance double sided laminate
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Geoffrey Leeds
Flex Product Manager
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It's Not Too Late!
Past OEM FORUMS Available for Viewing
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MOST OF OUR OEM FORUMS available for viewing
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QUALITY CONCERNS
JUNE 24, 2021
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The Undisputed "Made-in-America" Leader
Pacothane® ThermoPads™
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THERMOPADS™ can be used in any high-temperature lamination that requires the use of Exotic high Tg substrates. Whether you are using DuPont's Tk or your requirement is an LCP build, Thermopad with THERMOFILM™ offers the best conformable package with its robust attributes eliminating the uncertainty and negative impact of generic alternatives.
- Operating Temperatures up to 600°F (316°C) for extended press cycles
- Thickness is .044" (1.117mm)
- Predictable Control of Heat Rise excellent Thermal Conductivity due to Select uniform fiber distribution and controlled thickness and weight specifications of the Press Pad Design
- Uniform pressure throughout the pressure load
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Maintains flexibility and minimal brittleness when used with THERMOFILM™ to increase 3-Dimensional Conformance minimizing X-Y-Z axis stress on circuits
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The smooth surface of both THERMOFILM™ and THERMOPADS™ allows superior conformable properties against the differential surface of the circuit under high-temperature conditions
PACOTHANE TECHNOLOGIES and INSULECTRO – don’t work with those who follow – join those who lead!
PACOTHANE TECHNOLOGIES Proudly Produced in the USA with American Labor and American Materials!
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Geraldine Arseneau
Product Manager - Pacothane® Products
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And, don't forget, recently published Pacothane® Product Sample Guide available. Contact me for details. |
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Geraldine Arseneau
Product Manager - LCOA®
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CAC, Inc.
Superior Surface Quality,
Supporting Thinner Foils
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Remove those hard to clean, defect causing and throughput limiting separator plates.
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Reduce stack height - More panels per book per opening, CSC 7.5x thinner than separators
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Eliminate surface defects as the factory finish copper surface and profile is protected
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Production Efficiency gains by reducing the overall mass to heat AND cool in a cycle
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Layup Efficiency – No separators to clean, resurface or polish - labor intensive & costly
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Consistency in press stack mass CTE to copper & prepreg with CSC
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Increase quality assurance as image impressions and FOD concerns are minimized
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For additional information, samples, or data sheet, please contact me.
Mark Satchwell
Product Manager, Foil & CAC®
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Design Education - An Insulectro Priority
Insulectro Sponsors New Design Trade Association
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Printed Circuit Engineering Association™ (PCEA) is an international network of engineers, designers, fabricators, assemblers, and anyone related to printed circuit development.
Our mission is to promote printed circuit engineering as a profession by encouraging and facilitating the exchange of information and the integration of new design concepts through communications, seminars, and workshops.
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If you are a professional serving in the printed circuit industry from any associated discipline, you are encouraged to join. Membership is free and you’re encouraged to be involved as we all seek to collaborate, educate and inspire one another. Visit the web-site at: www.pce-a.org
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As advertised in i-Connect 007's PCB Magazine.
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INSULECTRO'S COPPER & COPPER FOIL OFFERINGS |
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Not All Copper Foil is Created Equally
Copper Complexity and Clarification
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Looking for 2mil and below lines and spaces. . .
Modified Semi Additive Process is a powerful HDI tool routing circuits around vias, as the pitch tightens your limited on the circuit between, which leads to increased layers and reduced performance. Utilizing carrier foils puts the fabricator back in control.
Electroplate copper to the desired thickness as the photo resist and copper plating form the circuit traces. The MicroThin carrier foil from Mitsui in 1.5μm, 3μm or 5μm acts as the circuit mold to produce vertical side walls eliminating the effect known as ‘tenting’ which allows the fabricator to create sub 2mil L/S as shown below.
The Grade 1 (IPC 4562a) carrier foils are supported on 18μm carrier achieve peels over 6/lbs per inch on FR4 resin systems whilst delivering a VLP2 (Rz 2μm) and smoother nodulation profile and can be used in lamination cycles up to 440 °F.
These carrier foils will be incorporated fully into the upcoming IPC 4562 specification revision due out later this year.
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For further assistance, connect with me by email, phone, or in person!
Mark Satchwell
Product Manager, Foil & CAC®
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“Being consistent on your mesh tension, throughout its life in the frame, helps keep ink coverage consistent ensuring process performance and repeatability.” |
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Shur-loc, IBC Brush and Equipment Service are being recognized by customers as key contributing factors in Insulectro helping them to increase their departments efficiencies in areas of their facility.
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“Being consistent on your mesh tension, throughout its life in the frame, helps keep ink coverage consistent ensuring process performance and repeatability.”
- Each mesh panel has a color-coded edge as well as the information stamped in one corner.
- Available in the common 22.5 degree angle needed for LPI or 90 degree for photo imagable legend ink.
Call myself or your local account manager for a system quote to see how quickly your return on investment will be!
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Contact your Insulectro Account Manager to see how the Shurloc frame system can better assist at your facility!
Shurloc can custom fit almost any size frame to your application.
- Ease of use, “anyone” can learn to stretch a frame.
- Continuous consistent tension throughout the frame
- Frames can be stretched in a matter of minutes
- Ready for use immediately (no more leaving frames/mesh settle out for hours and then having to re-tension before use.)
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Going Beyond
the Tool Case
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Working with IBC for over the past 15 years, we’ve worked together in making sure that their brushes are manufactured with the best possible specifications to give optimal performance to the printed circuit industry.
We can also perform regularly scheduled brush changes in your machine. We don’t just change your brushes and walk away. This piece of equipment will go thru a specific number of tests along with a review of other areas of the machine before we leave it to production. What we like to call as…….
Going Beyond the Tool Case!
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“Customers are beginning to see the difference in having us assist their maintenance staff in the ever-important preventative maintenance programs needed to uphold an equipment’s performance.” |
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- Are you getting the best performance out of your equipment?
- Is your equipment DOWN more than it is UP?
- Let us lend a hand by assisting your maintenance team.
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Remember that we can assist in your equipment needs through the following:
- Equipment Reviews and Audits
- Service and support
- Preventative Maintenance Programs
The calls for Preventative Maintenance Programs are increasing as customers understand the benefits this brings to their equipment’s overall performance and up time.
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Also, do you have a used piece of equipment you’re looking to get installed? We may be able to assist here as well!
Ruben Zambrano
Field Application Engineer
Cell: 847-345-3759
Mike Engle
Field Application Engineer
Cell: 360-749-1756
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Please reach out should you like to discuss any of these topics further.
Thank you.
Kevin Barrett,
Product Manager - Equipment
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Today's Copper Foils
for Tomorrow’s Applications!
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Tailored to meet market trends such as compartment miniaturization, vehicle electrification and increased connectivity demands require improved characteristics of both wrought and ED foils.
Focus on wrought solutions such as:
- Low profile height (Rz) for signal integrity, as low as 0.4µm
- Consistent profile height across the web which does not change when ordering thicker foils
- Alloy foil with Increased tensile strengths which can exceed 700Mpa
- Grain structure in terms of large crystals and uniform orientation improves fatigue resistance and provides excellent vibration resistance.
- Thermal resistance to withstand hostile environments for automotive applications.
Wrought foils released to IPC 4562A in grade 5, grade 7 and grade 8.
Call us to find out more – we love to talk about this stuff!
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Give us a call to discuss how CAC can help you
make better circuits faster.
Mark Satchwell
Product Manager, Copper Foils
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Everyday Materials You Need, On Our Shelves Every Day
Insulectro recognizes the importance of maintaining adequate inventory to begin work. Designers know when you need it, you need it. Using the link getpumafast.com, you can see what PumaFast™ and standard materials we stock to get you up and running.
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Covid-19 has not stopped our ACT! initiatives!
We have successfully collaborated on many ACT! opportunities.
We are delivering on Technology, Design and Education while you can bank on the sales results!
We are virtually taking our ACT!
to another level!
Insulectro and our partners are moving the chains to help our customers exceed performance goals. Our team of professional and technical resources are now offering our customers access to design and education services.
This is a Game Changer!
Our ACT! Initiatives combined with our design and education services provide our customers a total solutions package with a one-stop-shop option.
Our customers now have total access to not only our Insulectro foot print, best in class products, materials on the shelf when you need them; but also the expertise to deliver solutions from design to delivery…FAST!
Call me and to set up a VIRTUAL ACT! with your customer.
There's a reason I'm smiling.
Ron Murdock
ACT! Manager & Technical Account Manager
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To be the easiest company to do business with. . .
Insulectro has a program for continual improvement, all designed to make ourselves as user-friendly as possible to our customers, their customers, and our suppliers. Speed Matters, so we focus a lot of attention on getting you the materials you need as quickly as possible.
Our PumaFast™ Program lists current inventory of everyday materials you need every day.
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Best-in-Class Materials
from our Premier Suppliers
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