Jumpstart Your Grid Modernization & Energy Management Objectives
Critical Link FPGA SoMs for Energy & Utilities
As the planet’s power grid transforms to support renewable energy sources, providers in the power sector will need innovative technologies and reliability solutions to upgrade the existing infrastructure. An optimal way to achieve this is by leveraging the customizability of FPGA System-on-Modules (SoM) to meet the complex and evolving requirements of the next-generation power infrastructure. Critical Link provides several Intel® FPGA-based SoM products to Energy and Utilities OEMs to lead this transition in a timely and cost-effective manner.

Two of these low-power SoM families are the MitySOM®-5CSX and MitySOM®-C10L. The MitySOM®-5CSX is a highly configurable SoM based upon the Intel® Cyclone®-V SoC FPGA that delivers industrial board-level performance in a compact 3.2”x1.5” form factor. Available with either the Cyclone®-V SE or SX FPGA, which integrates ARM Cortex-A9 processor cores and supports several high-level operating systems.

The MitySOM®-C10L module is based upon the Intel® Cyclone® 10LP FPGA that is user configurable and is in an even smaller 70mm x 30mm (2.75” x 1.2”) SODIMM form factor. The Cyclone® 10 LP FPGA is available with FPGA logic elements from 16K to 80K, up to 2.7Mbits of on-FPGA embedded memory, and up to 244 DSP blocks. RISC-V soft processor core and numerous communications IP support a wide range of industry-standard interfaces.

Both MitySOMs are offered as part of a development kit for evaluation and initial development. These development kits provide the power management for the SoM, on-board peripherals, communications interfaces, expansion connectors, and USB Blaster to enable system implementation and programming. In addition, free lifetime access to Critical Link’s technical support site as well as access to application engineering resources and other services are available to accelerate product time-to-market.
  • 3.2” x 1.5” board with a 314-pin Card Edge Connector
  • Intel® Cyclone®-V SoC FPGA with 925MHz Dual-core ARM Cortex-A9 32-bit processor
  • Up to 2GB ECC DDR3 HPS memory, up to 512MB DDR3 FPGA memory and 272MB QSPI Flash
  • Up to 133 User FPGA IOs, 44 HPS IOs, RTC and Temperature Sensor 

  • 2.75” x 1.2” board with a DDR4 SODIMM-style 260-pin card edge connector
  • Intel® Cyclone® 10 LP FPGA with up to 80KLE
  • RISC-V soft processor IP cores
  • Up to 32MB of HyperRAM, up to 32MB of QSPI flash memory and 2KB of EEPROM
  • Up to 180 direct connect FPGA IOs in 3 user configurable I/O standard groups 
Target Applications
  • Energy and Utilities Infrastructure
  • Drones and UAVs
  • Embedded and Industrial Instrumentation
  • Test and Measurement
Compact, Efficient i.MX Crossover MCU’s on SOMs & SBCs with Rich Communications, Industrial IO, Graphics, Audio and Security
TQ Embedded, known for its precision-engineered, industrial strength SOMs and SBCs, first-in-class technical support, and their in-house process for true long-life availability – answers the needs for industrial strength energy management applications. Utilizing NXP’s crossover MCUs, namely the i.MX RT1170 family, users get robust application processor interfaces like Gb Ethernet (1x TSN), USB 2.0, CAN, UARTs, MIPI, and more. Additionally, the second Cortex® processor handles a multitude of low-level interfaces like I2C, SPI, GPIO, audio, and analog. Then there’s the GPU and integrated security functionality, all within the footprint of a credit card and about 1 watt. One could build an e-vehicle charging station around this SOM. 

The TQMa117xL SOM is also offered as the processing core of an SBC: MBa117xL. 
SOM Features:
  • i.MX 1170 family of NXP Crossover MCU’s (Cortex® M7 & M4)
  • Application interfaces up to: 2x Gb Ethernet (1x TSN), 2x USB 2.0, 3x CAN, 12x UART
  • Rich set of communications, peripherals and video – up to:
  • 2x SDIO/eMMc, 6x I2C, 6x SPI, SPDIF, multiples of QSPI, SAI, DMIC, ADC’s, more
  • GPU, MIPI DSI & CSI, parallel LCD
  • RTC, Temp sensor
  • Integrated Security element
  • Extended Temp Range available (-40 to 85C)
  • Small form factor: 31mm x 31mm
  • Low power: 1 watt typical, 5V supply
  • True long-life availability
Analog Devices is Powering a Brighter Future
ADI’s sensing, signal conversion, and signal processing technology powers energy infrastructure worldwide. From microgrids and utilities to data centers and factories and more. Our knowledgeable team can help you design intelligent, flexible, efficient systems to help reach your business goals.

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Macnica Americas, Inc. is the North America division of Macnica Fuji Electronics Holdings, Inc., a $7.5B global leader in technology product distribution, technical support, and design services.
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