MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe München from April 26-29th, 2022. This is the 25th year of LASER World of PHOTONICS the world’s leading trade fair for components, systems and applications of photonics. Learn more about the show.

Visit MRSI in Hall B5 Booth #438 to learn more about our die bonding solutions for photonics packaging. We offer high speed flexible automated systems covering all major markets and applications from R&D to high volume manufacturing. Let’s discuss your challenges getting products to market and how we have helped many customers scale their production.

Advanced optoelectronic components and modules are experiencing record demand driven by the rapid growth in cloud computing, data transfer and storage, and the adoption of the internet-of-things. The high power requirements, small component sizes, and elimination of materials which can outgas result in the need to attach many optoelectronic components with the eutectic die bonding process. Eutectic bonding is the process of using a solder alloy as a third material to form a continuous bond between two components. For over 35 years MRSI has developed a family of high precision eutectic die bonders for high volume manufacturing of photonics packaging.

Contact us to schedule a meeting at the show.

The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3^rd, 2022 at the Boxboro Regency Hotel. The Symposium’s theme this year is “Delta Blues.”

Technical sessions include Advanced Packaging, RF& Microwave – 5G Innovations and Microwave Emerging Technology, Interconnect Technology, Thermal Management, Photonics & Optoelectronics Packaging, MEMs, and University Innovations in Technology. Read the IMAPS New England Symposium program for more details.

MRSI is a Platinum sponsor of iMAPS New England Symposium this year. Dr. Yi Qian, MRSI’s VP & GM, MRSI Systems has been co-chairing the Photonics & Optoelectronics Packaging session for five years.

Visit the MRSI Website for details of Applications and Product solutions. Contact MRSI Systems to learn about our assembly solutions. Visit MRSI at IMAPS New England on May 3rd. We hope to see you there.

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2022年伊始，迈锐斯自动化（深圳）有限公司总经理， MRSI (Mycronic集团)战略市场高级总监-周利民博士接受了《化合物半导体》专刊的高端访谈，在访谈中周博士向大家分享了2022年化合物半导体行业的发展趋势与挑战，并介绍MRSI的贴片解决方案广泛服务于第三代化合物半导体中的特点与优势。

化合物半导体问：2022年已经到来，你如何看待在新的一年中， 化合物半导体行业的发展趋势?哪些事情可能会发生?哪些进展可以预期?过去的2021年，有人称之为“第三代化合物半导体的发展元年”，请例举出一些已经发生的你认为对行业有重要影响的事件或者进展， 可以有哪些总结和感悟?

MRSI周利民博士答：化合物半导体市场在新的一年依然会持续2021年的增长势头。我们的这个判断是基于化合物半导体广阔的应用市场前景和其需求的持续快速增长，同时MRSI是化合物半导体封装设备的领先供应商，也是基于我们封装设备在化合物半导体应用领域近年业务发展的实践和展望。随着新能源、5G、IoT物联网时代的来临，以砷化镓(GaAs)、磷化铟(InP)氮化镓(GaN)、碳化硅(SiC)为代表的化合物半导体市场正在快速崛起。另外，射频功率在航空航天、国防和军事应用中的使用显著增加，进一步推动了化合物半导体市场的增长。化合物半导体行业在下游需求及产业政策推动下，大量资金涌入化合物半导体行业，从上游衬底、外延生产，中游制造、封装到下游产品应用。进入2022年，化合物半导体在政府的产业政策导向和大量资本涌入的环境下，仍然会是资本投资的一个热点领域。可以预期的是在新的一年，一些掌握了核心技术和专注于核心技术研发的企业会在某些技术与应用上会有突破，在打破国外的技术封锁和垄断方面取得较大的进展，同时，也可以预测的是全球化合物半导体产业的产能扩张与并购会持续发生。