Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as thermal compression bonding, DAF bonding, BGA/copper pillar bonding, eutectic bonding, hybrid bonding and more. While these techniques are very different from a process point of view, they share many key requirements for bonding equipment, namely:



• Ability to handle up to 300mm Silicon Wafer
• High Placement Accuracy (soon to be below 1µm and may approach 50-100nm for hybrid bonding)
• In-situ Surface Treatment, e.g., plasma treatment, to remove organic contaminants, and oxide, as well as to activate the surface
• Well-controlled heating for a large area from bottom and top, including using a Laser as a Heat Source
• Potentially High Force Bonding with good force and Coplanarity Control

MRSI’s submicron S-HVM die bonder is equipped with a 300mm wafer to handle advanced packaging requirements.

Photonics West

It is the premier photonics and laser exhibition which hosts more than 1,400 companies. Schedule a meeting at the show to discuss your advanced packaging requirements.

• January 30-February 1, 2024
• The Moscone Center
• San Francisco, CA, US
• Booth #5409

Chiplet Summit

MRSI is sponsoring the Second Annual Chiplet Summit. It is the only event totally dedicated to the skyrocketing chiplet market. We hope to see you there!

• February 6-8, 2024
• Santa Clara Convention Center
• Santa Clara, CA, US

554 Clark Road, Tewksbury, MA 01876  •  +1 978 667 9449

mrsisystems.com