Advanced Packaging for Heterogenous Integration

November 2023

Advanced Packaging for Heterogeneous Integration
MRSI Spotlight
Training Programs
Trade Show News
Blog Insights

Advanced Packaging f or Heterogeneous Integration

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as thermal compression bonding, DAF bonding, BGA/copper pillar bonding, eutectic bonding, hybrid bonding and more. While these techniques are very different from a process point of view, they share many key requirements for bonding equipment, namely:

Ability to handle up to 300mm Silicon Wafer
High Placement Accuracy (soon to be below 1µm and may approach 50-100nm for hybrid bonding)
In-situ Surface Treatment, e.g., plasma treatment, to remove organic contaminants, and oxide, as well as to activate the surface
Well-controlled heating for a large area from bottom and top, including using a Laser as a Heat Source
Potentially High Force Bonding with good force and Coplanarity Control

MRSI’s submicron S-HVM die bonder is equipped with a 300mm wafer to handle advanced packaging requirements.

MRSI Spotlight: 3D InCites Member Interview

Peter Cronin, Director of Sales - North America, MRSI was recently interviewed by Francoise von Trapp, 3D InCites at the IMAPS Symposium. Peter discussed the latest in advanced packaging and MRSI's innovations.

Listen to the Podcast

Training Programs

MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI Applications Engineers with many years of experience with MRSI die bonding and epoxy dispensing solutions. Tailored to meet the unique needs of each customer, the programs encompass vital concepts such as robot orientation, teaching alignments, the die bonding process, and production setup.

Comprehensive training programs are targeted to a range of audiences-

Operator
Programming
Maintenance

Depending on the specific program, the sessions span a duration of 2 to 5 days, offering a hands-on learning experience.

Additionally, we offer the flexibility to conduct these training programs on-site at the customer’s location. Please contact the service department at service.mrsi@mycronic.com or call 978-667-9449 for more details about these programs.

Learn More

Trade Show News

Photonics West

It is the premier photonics and laser exhibition which hosts more than 1,400 companies. Schedule a meeting at the show to discuss your advanced packaging requirements.

January 30-February 1, 2024
The Moscone Center
San Francisco, CA, US
Booth #5409

Chiplet Summit

MRSI is sponsoring the Second Annual Chiplet Summit. It is the only event totally dedicated to the skyrocketing chiplet market. We hope to see you there!

February 6-8, 2024
Santa Clara Convention Center
Santa Clara, CA, US

Schedule Meeting

Products

Blog Insights

554 Clark Road, Tewksbury, MA 01876 • +1 978 667 9449

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