The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems was invited to the symposium and delivered a keynote speech titled ”Key technologies of chip assembling for compound semiconductor devices in 5G.”
“Compound semiconductors have played a crucial role in the 5G devices used in optical communication systems, high-density data storage, and 5G IoT sensors etc.,” Dr. Zhou said in his speech. For these optoelectronic devices, the die attach process is a critical technology for long term device reliability. Compound Semiconductor crystals are difficult to grow, because they have more defects and are more fragile and have a higher cost when compared with silicon, but compound semiconductors are increasingly being used in a number of fast-growing 5G potential markets due to their unique material properties. Silicon optical technology is based on silicon and silicon substrate materials (such as SiGe/Si, SOI, etc.), using existing CMOS technology for optical device development and integration of a new generation of technology, which is a faster growing innovative technology in the 5G era. Compound semiconductor chip packaging materials, processes and equipment are key factors affecting product reliability, and there are some special requirements and challenges compared with silicon chip packaging. Compound semiconductor chip packaging in the 5G era requires die attach process with high reliability, high precision, high speed and high flexibility."
