THE THIRD EDITION OF PUMANEWS |
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As I see it. . .
Insulectro has placed a priority on growth over the past several years - particularly in the areas of plant, property, and equipment. But the greatest asset we can invest in is our bench of superstar teammates.
When you invest in people, the rest falls into place.
In this issue of PumaNews™, you'll meet some new players in our company - some from outside our industry - with extensive careers solving challenges we often encounter. Amazing people with transferable skills. We are totally bullish on the future of the PCB industry and the strength of the American workforce.
Priorities for us are:
- Enlisting the best people who share our values - teammates and advisors
- Broadening our line of materials from the strongest suppliers
- Building a strong financial position to ensure no missed opportunities
- Automating our operations and business processes
- Investing and upgrading our equipment and locations
- Focusing aggressively on cybersecurity to maintain trust and integrity
And. . . an energetic, yet conservative strategy that will keep us always moving forward.
Patrick Redfern
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LOOK FOR '1@5 FEATURED ARTICLE' FLAG ABOVE EACH OF THE BELOW STORIES.
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1@5 America's Copper Expert Joe Bevan Retires!
2@5 Meet South Coast Circuit's Amanda Burgesser
3@5 Isola's TerraGreen® 400G is Released!
4@5 What about Melinex® Polyester Film?
5@5 All Stuck Up with DuPont's Pyralux® HT Adhesive
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Growing to Support PCB Manufacturers
PCBAA Expands Its Member Base
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PCBAA has new members joining founding members - AGY, Calumet, Insulectro, Isola, Summit Interconnect, and TTM Technologies.
New members include Denkai America, MacDermid Alpha, Pacothane Technologies, and Rogers Corporation.
The Printed Circuit Board Association of America is a consortium of companies, representatives, and enthusiasts who are advocating U.S. manufacture of printed circuit boards.
Insulectro is proud to support PCBAA's effort as a founding member.
We encourage you to not stand on the sidelines but get involved with PCBAA's three main mission objectives:
- Support the Domestic Production of PCBs
- Enhance Domestic Supply Chain Security
- Advocate for Initiatives that Create Fair Market Conditions
This organization will make a difference.
See below for more information and a link to inquire about membership.
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SALES & OPERATIONS MANAGEMENT |
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Ken Parent Speaks Out!
Learn On!
School's Open
SEPTEMBER 2021
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As schools open and students are back in session, I reflect on how many of these students we will be able to attract into our business to carry the flag of North American PCB manufacturing. I wrote last month about Insulectro’s commitment to education to bridge the gap of the need for talented people and the expansion of electronics manufacturing and technology advancement.
At the risk of sounding like a broken record, the need to attract, educate and retain great talent is paramount to the growing demand of building Future Circuits Faster. Insulectro will continue to offer our support to you in bringing our best resources together to educate. Our team continues to invest in updating our process and product lessons and organizing them in a fashion that makes us available to engage fast in educating those that have the desire to learn. Learning about processes and new technology will create opportunities, these opportunities I believe will help retain talent.
The industry is coming up with new ways to bring resources together. I highly recommend staying current in how the industry is moving forward with new groups of resources.
Groups like:
Printed Circuit Board Association of America, (PCBAA)
United States Partnership for Assured Electronics (USPAE)
Printed Circuit Engineering Association (PCEA )
All are organizations helping to invest and educate the market. Insulectro is active in all three of the groups today and expects these groups to contribute to the success of the North American PCB business.
Patrick Redfern is our point person for PCBAA, Ken Parent is our point person for USPAE, and Michael Creeden is our point person for the PCEA. Please let us know how we can help navigate these groups and where each group may play a role in your business.
How much of your time is spent on educating yourself and your team? How can Insulectro help you and your team?
I am fortunate this week, I have several hours of education scheduled. Two hours as a student in a session taught by DuPont’s Chuck Miserendino and an hour to teach Insulectro’s newest hires about Insulectro’s vision.
Always be learning! Always be teaching!
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Ken Parent
Chief Operating Officer
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Congratulations, Thank You, & Best Wishes
Industry Copper Expert Joe Bevan Retires!
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I’m sure when he started in the Artwork Generation and Design group at Western Electric in Richmond, VA in 1975, Joe Bevan didn’t dream that he would continue to spend the next forty-six years in the Printed Circuit Board Industry.
But Joe continued to serve the electronics business in almost every capacity working in Engineering, Operations, and Process Area Management for many PCB fabricators including Litton ACD in Springfield, MO; Trans Circuits in Falls Church, CA; Automata in Sterling, CA; and Tri Circuits in Zebulon, NC. Joe was also President and Owner of Circuit Concepts Inc. in Ashland, VA.
Not only have the PCB fabricators benefited from Joe’s commitment to advance the PCB industry, but Joe also served in a range of Sales, Technical Sales and Support and Product Management roles for several suppliers including Krone and Rubin, ESI, JJA/Gould, CAC, and finally Insulectro.
Working in almost every department of a PCB shop, as well as several Manufacturing and Distribution Companies prepared Joe for being one of the best troubleshooter and problem solvers in the business that I’ve met. Of course, PCB technologies have grown and improved, but having the foundation in manufacturing operations, the desire to always be learning, and the ability to share his knowledge with others has continued to bring value to every customer and supplier that Joe has worked with.
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(ABOVE: Insulectro teammates celebrate with Joe on the West Coast) |
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Insulectro is extremely lucky to have had Joe spend the last fourteen years of his career working to bring all of these experiences together for the benefit and support of our customers and suppliers.
Joe has a passion for helping others, taking calls at all times of day and night, and in the last year, he worked hard to transfer as much knowledge as possible to the other Insulectro teammates and customers. Joe should be proud of the legacy he is leaving to our industry, and he will be fondly remembered as the Lamination Department guru, the Copper Expert, the guy that always has the latest technology gadgets, and so much more.
As Joe retires, we are reminded of the history, knowledge, and talent that we are losing, but also inspired by the importance of Training and Educating the new, young engineers entering the industry that will hopefully have a long, rewarding career in Electronics like Joe has.
Thank you, Joe, for all your years of service to the PCB Industry! We will miss your friendship, mentorship, and contributions to the business and wish you the best as you spend precious time with your family!
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Michelle Walsh
Vice President of Product Management
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IPC APEX EXPO in San Diego January 2022
Mask, Proof of Vaccination, or Negative COVID Testing Required of All
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From IPC Leadership Team:
"The safety, security, and health of attendees at IPC APEX EXPO is our top priority. To mitigate the risk of COVID-19 transmission, IPC will follow the guidelines set by the California Department of Public Health, requiring vaccine verification or negative testing to ‘indoor mega events’ involving 1,000 or more participants.
"Attendees, exhibitors, speakers, instructors, staff, and all convention center contractors attending/working at IPC APEX EXPO 2022, to be held in person January 22-27 at the San Diego Convention Center in San Diego, California, will be required to present either proof of full vaccination or a negative COVID-19 test within 72 hours of arrival to enter the event.
"Detailed information regarding procedures for submitting this information to IPC prior to your arrival at IPC APEX EXPO, will be announced in the upcoming months.
"In the interim, please visit our COVID-19 page for the most up-to-date information.
"IPC is dedicated to providing a safe environment to meet in person in January and we look forward to your participation."
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Interviewed at DesignCon:
Jim Hartzell: "Isola Navigating a
Challenging Supply Stream"
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I-Connect 007's Nolan Johnson and Andy Shaughnessy Interview Jim Hartzell, Isola's Vice President of Sales and OEM Marketing for North America. (see link below for full article)
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JIM HARTZELL: Isola has been fortunate enough to stay extremely busy through these times and the operations team has been hitting record numbers of our shipments and so forth. From that standpoint, COVID hasn’t had a real big impact.
Certainly, going and seeing customers has had a big impact due to COVID. Shows like DesignCon is where we’re getting a little bit of face time, but for the most part, we’ve been able to come through this shutdown pretty well.
We’re having some issues and some challenges on the logistics side of the business. A lot of our raw materials come in, either by ocean container or by air, but because of logistics delays, we’re having to ship a lot in by air. We’re seeing a significant number of delays coming in from ocean containers, particularly anything coming in from Asia. . .
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Chris Hunrath on Future Tech
Microvias. . . both the Strength & Weakness of HDI
SEPTEMBER 2021
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Using plating in PCBs to link layers in the z-axis goes back to the 1940s. This was of course double-sided PCBs and that small advancement increased the functionality of the device. This had been done previously by more mechanical means with wires, rivets, etc. but plating really opened the possibility of high-volume production and later, true multilayers. Add to that blind microvias and improved circuits imaging and now you have the foundation for HDI.
Blind microvias have many design, density and signal integrity advantages over plated through holes. They do come with some manufacturing and reliability challenges, advances in plating and materials continue to push the limits allowing for greater use and therefore density. This “push-pull” relationship will continue with the evolution of the technology.
Advancements in copper circuit formation with Direct Imaging, additive plating, and micro-foils will push the need for more and stacked microvias even further.
One of the inherent issues with blind microvias is the difference in CTE between copper metal and many dielectric polymers. This is less of an issue with a plated through hole where the copper sidewall can “stretch” with the material as it expands during soldering (assembly). Indeed, the copper (plating) and dielectric interaction can be complex. Everything from design (via locations), copper power and ground plane fill, glass to resin ratios, and plating integrity can make or break the overall reliability.
We expect to see a lot of work in these areas. One place is the base copper (foil) to electroplate interface. Our colleagues at DuPont continue to develop technologies in this space and will be starting a series published in PumaNews™. We will be working together to bring some great processes to our customers and increase their HDI capabilities.
As always, you don’t need to wait for the newsletter, let us know if you would like more information and we can set it up.
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Chris Hunrath
Vice President of Technology
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Interviewed at DesignCon:
Chris Hunrath: "Working on A Lot of
New Technology"
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I-Connect 007's Andy Shaughnessy Interviews Insulectro's VP of Technology Chris Hunrath during DesignCon (see link below for full article)
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CHRIS HUNRATH: We’ve been busy on a lot of different fronts. Certainly, there have been a lot of challenges with getting certain materials with the container terminal issues. But we’ve also been working on a lot of new technology, and some old technology that’s new to PCBs. One example is mSAP.
There’s been a lot of interest in mSAP, the modified semi-additive technology. We’ve been working on some thin dielectric materials. Film-based dielectrics are something we’ve been working with on the DuPont side for some time. But it’s having higher relevance now.
We’re seeing some unusual copper weights for these new high-power chips, like 1.5-ounce copper. We’re just in the middle of introducing a new embedded resistor technology. So, yes, there have been several areas where we’re working on some new technology. . .
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Trust & Integrity
Celebrating Cybersecurity Controls
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Cybersecurity is an important priority for all businesses today. At Insulectro, we continuously invest in improving and fortifying our security; always staying abreast of changes and new threats as we navigate this ever-changing landscape. As a vital part of their supply chain, these preparations ensure that our customers can trust us and the integrity of connection to our information, whenever and wherever they need.
Understanding that people are the greatest risk to a secured network environment, we leverage a best-in-class program for our Security Awareness Training that includes monthly phish simulations and tracks our improvements. Our August “phish-prone” rate of 1.5% is significantly better than all industry benchmarks, with the average benchmark being 3.6%. We follow this up with regular “table-top” cyber-attack exercises to simulate the “what if” situational preparations of our IT staff.
Beyond training, our investments have included next-generation antivirus and firewalls, multi-factor authentication, artificial intelligence, and machine learning-based intelligent threat monitoring, and more. Cybersecurity today involves establishing appropriate policies, improved processes, and continuous training and communication.
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At Insulectro we embrace and even celebrate our cybersecurity controls, with raffles to reward those who “spot a phish” in their email. The same Insulectro culture that values urgency, intelligence, and dependability as the vital supplier who enables our customers to make better circuits faster, carries over to our approach to cybersecurity every day.
We do this because we know that a connected world is only as strong as its weakest link, and we want our customers to know that they can rely on Insulectro to bring best-in-class strength to their supply chain.
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Kathy Linares
Vice President of IT
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Insulectro PumaNews™ will write, curate, and publish provocative articles on innovation, vision, and thought leadership in our industry spotlighting people who make a difference. |
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Current & Challenged
Meet Amanda Burgesser
Vice President, Business Development
South Coast Circuits (A Royal EMS Company)
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I found myself wandering into the Semiconductor industry in 2007 while I was finishing my undergrad degree. My focus in school at the time was English Literature and my plan was to go on to law school from there. Little did I know that my future held other plans.
I grew up in a military family in Dallas, Texas. I attended about a dozen different schools in my K-12 academic years. This had the advantages of always being the new kid in class, and also had the disadvantage of always being the new kid in class. What it taught me at a young age was how to adapt to change and pivot my reactions to uncertainty. This skill set comes in very useful within the ever-changing and unpredictable world of the semiconductor industry.
In 2007 I joined Broadcom Corp. as a Project Manager. Shortly after my arrival I understood the need of this “adaptable” skill set I had acquired over the years within the department. I worked at Broadcom for almost 10 years and was able to climb the ladder into leadership and management roles with the help of champions within the company.
I went on to join a company focusing on mechanical and applications engineering as the COO. I was in this role for 4 years and loved coming in to work each day. Some people enjoy waking up in the morning and knowing what the day would bring them. For me, the comfort came with being able to resolve the unexpected and the unforeseen; solving problems.
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Recently I have joined South Coast Circuits, within the Royal EMS company, as the Vice President of Business Development (LEFT: Amanda and South Coast's Chuck Benson).
The senior leadership and ownership value innovation and project a supportive company culture. There are so many changes in the industry and around the world that are not within our control. It’s hard to plan or project for situations that we do not yet understand. It is within these moments however that we find our strength and direction to move forward.
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I have been asked on many occasions why I chose this industry. I am not an engineer. I am not a designer. So why and how am I advancing in this traditionally male business?
I read a quote online recently, “People join because of great vision. People leave because of poor leadership."
(RIGHT: Amanda and 4 year-old son practice golf together.)
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Being in a leadership role I strive every day to listen, to learn, and to support.
I want to continue the efforts of changing the misconception of who is traditionally fit for the semiconductor and PCB manufacturing roles.
Together we can break those molds and support a great industry towards the future.
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A Steady Hand in Global Supply Chain Turbulence
Insulectro Hires Supply/Demand Expert Montserrat Barcelo as Director of Supply Chain
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Montserrat Barcelo has been hired as Director of Supply Chain replacing Jason Shuppert who was recently promoted to Vice President of Operations.
“I am pleased to announce a new teammate to our Insulectro 'supply chain’ team, Montserrat Barcelo,” announced Ken Parent, Insulectro Chief Operating Officer, “Montse comes to us with an extensive and diverse background in the design, development, implementation, and management of supply chain operations.
She will report to Jason Shuppert who continues to oversee that area as a part of his new position.”
Barcelo has over 20 years’ experience in domestic and international operations including product/sales forecasting, inventory management, and long-range capacity requirements planning.
She has held positions at Ventura Foods as Demand Planning Manager; Advanced Bionics as Demand and Production Control Planning Manager, and most recently as Supply Chain Director for American Woodmark Corporation. In her varied career, she has held various supply chain positions at Tom’s Shoes, Pelican Products, among others.
“I’ve known Barcelo for many years and have always admired her ability to manage today, tomorrow, and next year when it comes to optimizing the supply chain,” stated Vice President of Operations Jason Shuppert. “She will bring her much needed knowledge and insight into materials planning, and her solid IT background, to Insulectro at a time when the industry’s global supply chain for PCB materials remains fluid.”
Barcelo holds an MBA in Global Business from Pepperdine University. She received her undergraduate degree as a Bachelor of Computer Sciences from the Instituto Tecnologico de Tijuana where she graduated cum laude. She’s a Six Sigma Green Belt, is a certified CPIM in Inventory Control – Supply Management with the Association for Supply Chain Management (ASCM).
Ken Parent concluded, “Montserrat is a wonderful talent to add to our bench of superstars. The times may be uncertain, but Insulectro certainly is commited to grow and expand to help our customers build better circuits, faster.”
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Fine-tuning Your Chemistry Needs
Larry Boehm Joins Insulectro
as Field Application Engineer
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Larry Boehm joins Insulectro after an extensive career as a product support specialist for a distributor of the Dow legacy chemicals recently acquired by DuPont.
Earlier this year, Insulectro acquired the distribution rights for the DuPont chemistry line for most of North America.
Larry is no stranger to the PCB manufacturing arena. He spent fourteen years at Sanmina-SCI Corporation in a variety of positions including Chemical Laboratory Supervisor/Group Leader, as well as Chemical Technician and Process Engineering Technician. for the past ten years, Larry provided technical support as an Account Manager and Technical process Support Specialist for East Coast Electronic Materials Supply (ECEMS) in Manchester, New Hampshire.
ECEMS was acquired by Insulectro earlier this year. We welcome Larry to the Puma family and look forward to his expertise in the chemicals we distribute.
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Calculating the Fairest Price
Johnny Le Joins Pricing Team as Analyst
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Insulectro is pleased to announce the addition of Johnny Le to the Pricing Team. Le has an impressive background in finance and as a Pricing analyst.
Prior to joining Insulectro, he held similar positions at Toughbuilt Industries, Hireright, and Spectrum Brands Hardware and Home Improvement where he also worked as an Accounts Receivable Reconciliation Analyst. He also held positions in Finance at Masimo Corporation and Allergan.
Johnny Le received his MBA at California State University - Fullerton where his Capstone Project involved developing a commercialization strategy for a medical software company to maximize the largest market share while generating the most value for its customers. He received his Bachelor's Degree from Cal State Long Beach in Finance, Real Estate, and Law.
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Halogen Free, Extremely Low Loss Laminate and Prepreg
Isola Launches TerraGreen® 400G
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Isola Group, a leading global manufacturer of copper-clad laminates and dielectric prepregs used to manufacture printed circuit boards, is launching its newest halogen free material ̶ TerraGreen® 400G.
TerraGreen® 400G is now available for customer sampling and UL qualification.
TerraGreen® 400G is an extremely low loss, thermally robust copper clad laminate and prepreg. TerraGreen® 400G is designed to deliver > 20% improved insertion loss over Tachyon® 100G at and above 28 GHz using next generation Low Dk glass and HVLP3 copper foil. TerraGreen® 400G also exhibits exceptional CAF (conductive anodic filament) resistance performance.
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TerraGreen® 400G was developed for applications that enable 5G telecommunications, high-speed servers, storage and computing, aerospace as well as broadband satellite technologies.
TerraGreen® 400G has demonstrated superior flow characteristics on 2 oz copper applications and offers easy FR-4 like processing. The standard copper offering is HVLP3 ultra smooth copper foil for minimal conductor loss with a surface roughness of ≤1.1 micron Rz JIS, 1/2 and 1 oz.
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Steven Sekanina, Director, High Speed Digital Products says, “We are excited to introduce this next generation product to the market. We anticipate that TerraGreen® 400G will provide designers the much-needed solution for next generation systems operating at 28 GHz and above.”
TerraGreen® 400G is available with standard core thickness’ ranging from 2 mil (0.05 mm) to 18 mil (0.46 mm) and a wide range of prepreg glass styles and resin contents, making suitable for a wide range of applications including heavy copper designs. Please visit Isola's website at www.isola-group.com for more information.
About Isola
Isola is a leading global material sciences company that designs, develops, manufactures and markets laminate materials used to fabricate advanced multilayer printed circuit boards, which provide the physical platforms for the semiconductors, passive components, and connection circuitry that power and control virtually all modern electronic products. Isola operates a network of factories worldwide.
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Norm Berry
Director, Laminates & OEM Marketing
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News from the DuPont Chemistry Desk
Get Your Fill with DUPONT™ MICROFILL™
EVF-III
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As the challenges and demands of the PCB industry continue to drive fabricators to BUILD BETTER BOARDS, FASTER, high-reliability blind-via filling technology becomes an increasingly critical process.
DuPont™ ICS continues to develop and innovate its metallization portfolio with the introduction of MICROFILL™ EVF-III to the North American PCB manufacturing market. The MICROFILL™ EVF-III has a well-established installation base in Asia, along with other DuPont™ ICS MICROFILL™ processes.
KEY FEATURES
- Latest high-reliability panel plate via-filling technology that reduces the need for planarization
- Compatible with vertical batch mode and vertical continuous plating (VCP) equipment
- Blind via geometries of 6x4, 5x4, and 4x4 (mils) filled with less than 20 µm surface copper
PROCESS ATTRIBUTES
- Compatible with multiple substrate types and electroless only or electroless + flash
- 3 component additive system – full analytical control by CVS
- High throughput system resulting in shorter plating time – targeting less than 120 minutes
EQUIPMENT DESIGN TECHNOLOGY
- Insoluble anodes utilizing copper oxide delivery system for metal replenishment
- Vertical manifold with impingement eductor nozzles and knife-edge agitation
- Variable frequency drive pumps with digital flowmeters
With uncertainty regarding the impact of planarization on the reliability of filled vias, the MICROFILL™ EVF-III process from DuPont™ ICS provides a panel plating solution.
DuPont™ ICS and Insulectro have partnered to offer both on-site and virtual technical presentations and design reviews to provide expertise on the ever-evolving challenges with blind-via filling.
For any questions, technical reviews, or training needs, don’t hesitate to reach out to me or your Insulectro Technical Account Manager.
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Paul Welter
Director of Sales, DuPont Chemistry
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At-A-Glance
The DuPont Chemistry Line
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With the acquisition of East Coast Electronic Material Supply (ECEMS) in late March, Insulectro has brought another best-in-class product line to our customers. The addition of the DuPont Electronics Imaging & Interconnect Solutions (ICS) chemistry line, which was legacy Dow Chemicals before the Dow-DuPont merger, adds a complimentary piece to an already robust Insulectro product offering.
DuPont ICS is innovating new metallization technologies across many platforms:
Electroplating Applications
HDI
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Microfill™ EVF-III for advanced via filling and through-hole plating
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Microfill™ LVF-IV for next generation SLP applications
MLB
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Copper Gleam™ PPR-II for high aspect ratio pulse plating
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Electroposit™ EP-1600 for high aspect ratio DC plating
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Copper Gleam™ HS-200 for horizontal DC plating in FPC applications
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Copper Gleam™ ST-920 for DC vertical continuous plating (VCP)
IC Package Substrate
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Microfill™ SFP-II & Microfill™ LVF-IV for advanced SAP applications
Making Holes Conductive
Electroless Copper Solutions:
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Circuposit™ 3350-1 Vertical Electroless Copper
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Circuposit™ 4000 Horizontal electroless copper for FPC/RFPC
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Circuposit™ 6700 Horizontal Ionic Catalyst for Advanced HDI applications
Direct Metallization Solutions:
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Next Generation Crimson™ & Conductron™ palladium-based systems
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Next Generation Graphite 2000™ carbon-based system
ENIG:
Duraposit™ SMT-88 & Aurolectroless™ SMT 520
Process Chemistries:
DuPont offers a full line of cleaners, developers, strippers and other ancillary products to support printed circuit applications.
General Metal Finishing:
Full line engineering, decorative and precious metal offerings
As you can see, through this addition of the DuPont ICS chemistry line, Insulectro is now providing chemistry and technical support to the general metal finishing, plating-on-plastics, and wire plating industries, which we see as an area of growth.
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Chemicals & Controllers
Focus Tech Chemicals
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Insulectro continues to offer Focus Tech processing chemistry for you PCB processing needs.
Products Offered
- Dryfilm Developing Chemistry
- Dryfilm Stripping Chemistry
- Tin Stripping
- Alternative Oxide
- Equipment Cleaners
- Waste Treatment Chemistry
- Plus, a variety of Process Chemistries
Control Equipment
Focus Tech offers chemistry control equipment to help manage the different chemical processes in the manufacturing process.
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Specific gravity controller
- Conductivity Controller
- Colorimeter controller
- Cupric Etch Controller
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Custom controllers with availability to connect to TrueChem software
Jeff Johnson
Product Manager - Dryfilm/Chemistry/Paste & FAE
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Chemplate Materials SL,
Producer of the InduBond® Systems, Distributed Puma style!
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The 230N with its double draw tooling plate will optimize your layup process, compatible with round or slot registration pins to achieve pinless lamination.
The benefits of pinless lamination are known but a reliable registration system is needed to support the press cycle. The 230N with its customizable tooling plates for round, slotted or even a combination of both blended in a double draw layup station delivers simplicity and efficiency.
The systems bonding heads of which can be ordered in a 4 or 6 head configuration bond the inner layers until the prepreg is fused and cured up to a 10 mm thickness (higher if requested).
During the lamination cycle the bonded areas can withstand up to 850°F per the InduBond® X-Press without physical pins. This ensures the best possible liner movement of ALL layers in the multilayer stack-up.
- 4 or 6 head Inductive bonding system for layer-to-layer registration
- Registration points can withstand high-temp press cycles
- The bonded location is flat, ensuring uniform pressure during the press cycle
- Eliminates costly hard tooling plates, pins, and bushings
- Max Inner layer size 30 x 25” (Min 10” x 10”)
- Unit size 5.6 ft H x 8.5 ft L x 6 ft W
The laminated panels will have been subjected to less internal stresses due to the elimination of the physical pins which can cause panel warping, distortion, and misalignment between the inner layers.
With registration being a cause of remakes and personnel shortages, let us help you build better circuits, faster!
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Mark Satchwell
Product Manager, Foil & CAC
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OPERATIONS & SUPPLY CHAIN |
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The Journey!
LEAN-ing in to World Class Manufacturing
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Last month I shared my thoughts on “a return to simplicity” in our operational focus, as we begin to build the key tenets of LEAN/World Class Manufacturing (WCM) into our operational team structure and strategy.
I was reminded recently in revisiting related topical literature, that building a LEAN culture with a World Class Manufacturing focus is a JOURNEY. It’s not a “flavor of the month”, and certainly is not just a “plug and play” operations initiative.
On the contrary, it’s a whole new organizational mentality where ALL employees are engaged in the constant pursuit of waste/variability reduction to safely deliver products/services of the highest quality, faster. This type of culture possesses a problem-solving focus/mentality, with standard work processes that are simple and visible, supported by easy-to-use systems and tools.
We are just beginning our more formalized WCM journey at Insulectro, and this mindset will continue to be integrated into our culture over time. That said, I am extremely pleased to see so many examples of awareness and positive momentum/results in the WCM key priority areas that I outlined last month:
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Safety First, ALWAYS – No reportable injuries for last month!
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Spotless Facilities (5S) – Great recent tour feedback from suppliers, customers, and key internal leaders!
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Uncompromised Quality – Passed ISO quality audits at Insulectro Londonderry & CAC!
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Customer Service Mindset – Continued GSD for our customers, despite major supplier delivery challenges
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Teamwork & Communication – Collaborative execution planning- Customers/Suppliers/Ops/Supply Chain
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Building Talent – Onboarding new teammates (Welcome Montse Barcelo, new Director of Supply Chain!)
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Continuous Improvement – Operational focus/refresher training to address non-conformance issues
Though we’re just setting out on a more formal LEAN/WCM journey, Insulectro teammates have always demonstrated a passion for GSD’ing the right way. I know as we integrate the WCM concepts more into our culture, the level of engagement of all teammates will continue to rise and will contribute to an environment of improving execution to enable our customers to build better circuits, FASTER!
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Jason Shuppert
Vice President of Operations
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Kapton® Films and Pyralux®
Superior Performance in
Satellite/Spacecraft Applications
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News Release - September 6, 2021 by DuPont Electronic Solutions |
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In addition to powering and protecting the recent Endeavor mission to Mars, innovative DuPont materials have played a vital role in space exploration vehicles and satellites for over 60 years. As these space missions get more complex, DuPont is helping designers and engineers look for new ways to use existing technologies or develop new ones to meet the ever-growing technological challenges being faced.
To assist in the development of the next generation of space vehicles, DuPont has developed a product selection guide that details the features of Kapton® polyimide films and Pyralux® copper-clad flexible circuit laminate materials.
These materials will be crucial to developing advanced reconfigurable antennas and multi-layer insulation blankets for the more than 5,000 smaller satellites (smallsats, less than 500kg) that are forecasted to be developed and launched in the next decade.
These antenna systems are lightweight, low-power, and miniaturized and are critical for performance of the various smallsat systems (telemetry, tracking and control (TTC), navigation, space-to-earth or space-to-space communications, radars, and remote sensing).
To protect the delicate electronics from extreme heat and cold and space weather, passive thermal control systems featuring Kapton® polyimide film are essential for use on deployable radiator panels or as the outer surface of a multi-layer insulation (MLI) blanket used on the satellite.
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A Super Matchup!
Make Your InduBond® Press
Sit Up & Take Notice
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Bacon and eggs. Black and tan. Mac and cheese. Bert and Ernie. InduBond® and Copper-Steel-Copper!
Bonded Copper foil including VLP profiles onto a Steel carrier ensures that not only the low-profile topography is protected but the surface is clean, free from causing signal integrity defects as all FOUR edges are sealed. It's a star performer in an InduBond® press!
Carrier foil is available from 1µm up to 5µm, now CSC bridges that gap offering foils from 6µm to 140µm.
CSC is available in 8 mil which has twice the image transfer resistance as 15 mil aluminum AND can replace up to SEVEN standard 62 mil steel separators. Those separators not only cause circuit surface imperfections impacting trace lines but reduce stack height allowing more panels per lamination cycle.
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I've got a lot to tell you about this matchup!
Mark Satchwell
Product Manager, Foil & CAC®
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PRINTED ELECTRONICS INKS & PASTES,
SUBSTRATES & FILMS
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Get to Know Our Substrates
Melinex® Polyester Films
from Dupont Teijin Films™
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Insulectro is well known as the largest supplier of materials used to manufacture printed circuit boards. This includes our rapidly growing substrate division making Insulectro your one stop shop for printed electronics.
In addition to being a first-in-class supplier, product specialists at Insulectro have in-depth product knowledge offering process consultations and onsite training to ensure the very best products are selected for each critical need. Insulectro readily stocks an ever growing assortment of substrates and this month we are highlighting Melinex® PET by DuPont Teijin Films™.
Melinex® is a DuPont polyester film that comes in crystal clear and opaque white versions. It can be pretreated on both sides for improved adhesion and overprinting with a wide range of solvent-based graphic inks and varnishes, silver conductive and dielectric inks. It is ideally suited for graphic and certain circuitry layers in membrane touch switches.
Some of the options that make Melinex® a great substrate for printed electronics include:
- Heat stabilized to give excellent dimensional stability at temperatures up to 302°F.
- Excellent adhesion to a wide range of solvent based inks, graphics inks and varnishes, silver conductive inks and dielectrics.
- Excellent durability and toughness giving long lasting switches, particularly when compared with polycarbonate.
- Greatly superior solvent resistance to polycarbonate, making MELINEX® particularly suitable for use in many industrial applications.
Let me tell you more about these incredible polyester films.
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Jeff Crawford
Insulectro PE Advanced Substrate Specialist
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DuPont™ Riston® Di9330 Dryfilm
Improve Inner Layer Yields on Shiny Copper
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Riston® Di9330 is the latest inner layer dryfilm from DuPont. This is a dual-wavelength film that can achieve tighter spaces than single wavelength films on multiwavelength image systems. This film also has superior conformance and adhesion to other dryfilms on the market.
It is currently available in 30 micron thickness.
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For more information, please contact me or your local Insulectro TAM. |
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Jeff Johnson
Product Manager - Dryfilm & Chemistry
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The People Behind the Puma
Meet JayGee Gozum
California Operations Manager
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BIO
Been with insulectro for 6 years. I’ve never worked for a company that made you feel like FAMILY. I was hired on as a material handler and have worked myself up to California Operations Manager. I can’t thank the Redfern companies enough for all the opportunities they have given me.
I WOULDN’T BE WHERE I'M AT WITHOUT MY LAKE FOREST AND SAN JOSE OPERATIONS TEAM! THEY ARE BEHIND ALL THE MAGIC!
February 21st 2021 my son was born. Best thing that has happen in my life by far. Kim and I are extremely lucky to have our son Kaycee in our lives. Having him has changed my views on things drastically. Everything I do is for him.
Jaygee is a guy you want to hang out with.
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What does a guy like you do to kick back?
Lounge chair, good liquor, and music. With close friends and family. That’s all I need.
Any favorite food you love to binge on?
Taco Bell tacos (weird I know).
You just found $10 million buried in your backyard. What would you do with it?
Call the police and report it…SIKE!!!! I’m buying a huge mansion and a ton of cars! After the impulse buying. I'd open up restaurants for my wife Kim - it’s a dream of hers.
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What’s your dream car?
My dream car is 1962 impala (street rod style).
Describe what your first day at Insulectro was like.
Damn! I’ll never forget it. haven’t worked a warehouse job in years. There was no time for an intro because the team was extremely short-staffed. It was me and another new hire, we hit the floor running and just learned as we go. Insulectro has come a looong way. since the first day I started…
What’s your favorite music? Movie? Book?
I listen to everything! From Hall and Oates to Blxst (hip hop artist)
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Complete the sentence: “I am happiest when I am ….”
With my family.
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Favorite Halloween costume?
Wreck-it Ralph
Where would travel if you could leave tomorrow and go anywhere?
Tokyo, Japan. They have an insane car culture there.
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If a movie was made about you, who would play your part?
Probably Michael Chiklis (played Ben Grimm from Fantastic 4) or Cee-lo Green, because people say I resemble them. I don’t see it…
Name three leadership principles you try most to exemplify.
Have solid values
Ownership
Earn trust
What have you personally learned about yourself from your teammates?
Patience! Things don’t happen overnight. you cant change everything!
If you had to hire your replacement, what would you look for in a candidate?
Has to fit the insulectro CULTURE. Someone that can crack jokes but also GSD.
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Halloween is coming. How will you dress up?
My son's first Halloween! We are leaning towards Moana. He loves Maui (yes I know, put a wig on me and I could be Maui, haha!)
How do you want to be remembered at Insulectro?
Someone you can always count on. I know I can’t please every single person, but I do my best. Also, someone that can put a smile on your face. I am stern and seem stressed out at times but I love to have a good laugh majority of the time.
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@Mike Creeden
Precluding Via Failures
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The only thing fatal about failure is the inability to learn from it!
Many of us are afraid to fail because we have been conditioned to believe that failure is the opposite of success, in fact, it’s really not. Failure is not the opposite of success. Failure can be the innovation of success.
How can you be successful without going through failures? One of the greatest inventors, Thomas Edison, once told a reporter that he has not failed, but instead, he has learned and discovered 10,000 ways that were not working. My hope is that with some education, we can learn from each other’s failures and successes.
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When we take this failure investigation to our designing and manufacturing of circuit boards, we find that there are so many ways that failure can occur. It is not just a simple matter of pass or fail in a binary sense, rather what we find is that there exists a sliding scale to failure that we call robustness or producibility.
This translates into the yield vs. cost equation. With so many ways that failure can occur, there is no one silver bullet to avoid potential failures. We really need to have a broad anti-failure approach to our design efforts and be ever vigilant for potential failure issues.
Each circuit design can have its own challenges with feature sizes, occurrences, and manufacturing issues. I wanted to avoid specifics of any one board and focus on one of the most common and insidious types of failure in PCBs. Plated hole structures, specifically the smallest vias, can often produce failures. These failures can also be hard to detect because they may be intermittent when subjected to thermal excursions.
Fabricators utilize various methods, materials, processes, equipment, and staff to build our boards. Fabricators work diligently to have all these aspects running at an optimum performance level for all boards. Granted, not all fabricators exist on an equal level, however, most all of them are consistently producing robust boards.
The ever-changing variable is our designs with feature sizes that are getting smaller every day and how we arrange these feature sizes on our circuits. We are also challenged by increased circuit densities, compressed schedules, and ever-increasing signal performance challenges. This makes for the perfect storm to allow failure points to come into our designs.
We can learn from the chart below that a combination of correct material selection, design implementation of via feature size, and usage patterns, contribute to avoidable failures.
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We often decide on the required via feature size that can be used to pin-escape our smallest BGA. Then we utilize that small size and challenging aspect ratio on every instance and layer of our board. This is a flawed approach contributing to lower reliability.
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We typically make statements like, “Avoid stacking your microvias to avoid failures.” This is a true statement, but in the reality of designing a dense board we will encroach on this principle with many variations of a partial stagger/stack pattern because we have a dense board with many thousands of via instances on multiple layers.
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The next avoidable failure point is to abdicate our material decisions to someone who will make the decision based on price alone, thinking all materials are the same. This can ignore the effects that material parameters both physical and electrical can contribute to the success or failures of the via structures.
Detecting via failures on our boards can be a very costly and tedious effort because via failures often will require testing under a heat environment where thermal expansion occurs. All this effort will not correct the problem. Hopefully, it will detect the problem leaving conclusions subject to analysis and deductive reasoning.
- Our best success is always to design with robust feature sizes, only utilizing the minimum feature sizes where absolutely necessary.
- Implement best practices when creating multi-layered patterns of vias avoiding stacking vias, especially being observant of overlapping via hole area.
- You would not allow anyone to select your resistor or component values, so why would you let someone select your material values as they play a significant role in the physical and electrical performance of our circuits and the robustness of our board yields.
At Insulectro, with our Design Education Program, we are eager to freely support signal-integrity reviews of design circuits prior to fabrication. Also, we are ready and eager to create one or several training sessions for the OEM or your fabrication team. These will be tailored to meet the exact needs of the audience, brought by a technically appropriate presenter, with specific content to further your team’s success and provide that edge to meet the needs of advancing technology trends.
Contact any of our Technical Account Managers or call any of our branch offices to schedule your Virtual Training Session soon.
Stay safe, happy, and healthy!
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Mike Creeden CID+ MIT
Technical Director, Insulectro Design & Education
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Insulectro Unleashes the
Incredible Power of 5
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Contact your Insulectro or Isola sales representative for more information.
Norm Berry
Director of Laminates & OEM Marketing
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Become a Puma!
Help us map out the future of Printed Circuit Board and Printed Electronics!
Join our Puma team and be a part of our growth.
Business Development
Operations
Pricing
Production
Warehouse
Others
Click on the ad (left) to see various positions we are recruiting.
As advertised in i-connect007's PCB Magazine
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Insulectro Unleashes the
Incredible Power of 5
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Geoff shouts: "Get sticky with it!"
Pyralux ® HT is the Premiere Adhesive for Extremes
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Pyralux® HT is the premier adhesive when going above and beyond the current offerings of flexible adhesives. With an IPC service temperature of 225 C the High Temp nature of this product allows your flexible designs to operate in harsh thermally demanding environments.
HT also has the added benefit of being able to be used without the current practice of “Bikini-cut” coverlays. This can enable many high-speed applications in rigid-flex designs that need to send signals from one rigid section to the other while eliminating cable loss. This is primarily due to the ability of the Pyralux HT material to withstand the lamination cycle of many traditional epoxy resin systems and the low loss nature of the Pyrlaux® HT.
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Pyralux® laminates are the only choice to enable high reliability, high density circuitry for flex applications. |
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Click-Out our
Pyralux® Flexible Laminates Selector Guide. . .
(click on product name)
The standard copper clad laminate systems for any flex or rigid flex designs.
The standard copper clad laminate systems for any flex or rigid flex designs.
Single sided flex copper clad substrate
Standard acrylic adhesives for building multi-layer flex designs. Offered as coverlay, sheet adhesives and bondplys.
Standard acrylic adhesives for building multi-layer flex designs. Offered as coverlay, sheet adhesives and bondplys.
An epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Offered as coverlay and sheet adhesive.
High temperature flexible adhesive system with an MOT of 225C.
Teflon®/Laminate system offered as a clad laminate or bondply. Ideal for RF designs.
Embedded resistance double sided laminate
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Geoffrey Leeds
Flex Product Manager
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Insulectro Unleashes the
Incredible Power of 5
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It's Not Too Late!
Past OEM FORUMS Available for Viewing
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You probably know by now our one-hour OEM FORUMS have garnered rave reviews and great attendance. Have you missed one and want to catch up?
All OEM FORUMs from our library are available by clicking on the box to view our complete library on VIMEO.
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QUALITY CONCERNS (coming soon)
JUNE 24, 2021
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Quick Release
Pacothane Announces New Release Film
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PACO QUICK PRESS™ is a two-sided Release Film engineered for High-Temperature Quick Press PCB laminations requiring an easy clean release after elevated temperature lamination cycles.
PACO QUICK PRESS™ brings standardization and predictability to the flex laminating process and offers tangible process advantages.
DATA SHEET
- Thickness: 5.25 mil (133 μm)
- Maximum Temp: 425º F (218º C)
- Appearance: White, Semi-translucent.
Please call us if you require additional information.
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PACOTHANE TECHNOLOGIES is the world's leading manufacturer of products to enhance and assist the production and quality assurance process for the lamination and manufacture of printed circuit boards [PCB].
Pacothane services the worldwide PCB and Smart Card markets, which includes Rigid Multilayer, Rigid/Flex, Cover-layer Flex, Flexible Multilayer, Copper, and Un-Clad Laminates.
These circuit boards are integrated into a wide variety of applications and markets that include telecom, data communications, high-speed computing, mobile devices, military, smart cards, medical and effectively all electronic products.
PACOTHANE TECHNOLOGIES® Proudly Produced in the USA with American Labor and American Materials!
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Geraldine Arseneau
Product Manager - Pacothane® Products
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And, don't forget, recently published Pacothane® Product Sample Guide available. Contact me for details. |
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Geraldine Arseneau
Product Manager - LCOA®
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CAC® Inc
Superior surface quality,
supporting thinner foils
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The best and most economical solution for using difficult-to-handle thin, reverse treated & double treated copper foils. Important to producers of increasingly high technology PCBs.
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Improve efficiency - All 4 edges are sealed from the factory, ensuring a pristine surface
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Increase productivity - supported 6µm to 140µm foils, eliminate handling defects
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Superior finish – Reduce image transfer by x2 with 8 mil CSC
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Limit variation – CSC achieves a comparable heat rise & cool down rate in a traditional press with separators
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Supply chain simplification - North American sourced aluminum, steel & copper
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For additional information, please contact me.
Mark Satchwell
Product Manager, Foil & CAC®
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Drills, routers, endmills!
Let Kemmer Improve Your Board Quality
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The PCB industry has seen a significant increase in the need for ENDMILLS.
Insulectro’s Kemmer line has a complete product offering of single, two, three and four flute designs for various applications and material types. Currently stocking endmills from .50mm to 1/8”.
Kemmer Tech-Centers are continuously reviewing endmill designs and carbides, through a series of tests to ensure that we meet the increasing quality requirements of all material types and applications.
Insulectro can help support your difficult applications and provide tools to ensure quality products.
Please contact your local Insulectro branch for additional product information and availability.
Geraldine Arseneau
Product Manager - Drill & Business Development - Canada
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Design Education - An Insulectro Priority
Insulectro Sponsors New Design Trade Association
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Printed Circuit Engineering Association™ (PCEA) is an international network of engineers, designers, fabricators, assemblers, and anyone related to printed circuit development.
Our mission is to promote printed circuit engineering as a profession by encouraging and facilitating the exchange of information and the integration of new design concepts through communications, seminars, and workshops.
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If you are a professional serving in the printed circuit industry from any associated discipline, you are encouraged to join. Membership is free and you’re encouraged to be involved as we all seek to collaborate, educate and inspire one another. Visit the web-site at: www.pce-a.org
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As advertised in i-Connect 007's PCB Magazine.
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INSULECTRO'S COPPER & COPPER FOIL OFFERINGS |
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Not All Foil is Created Equal!
Copper Complexity and Clarification
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At the Copper Foil intersection surrounding material profile sits Signal Intergity for data speeds and Adhesion nodules for peel strength.
We are going to review 3 different types of Grade 3 HTE foils, which are all produced domestically by Denkai America. The surface roughness (Rz) only tells part of the story, under magnification by an SEM you start to see the topography of the various foils which are designed to support specific prepregs.
- TOBIII 1/2oz (‘H’ per IPC) Matte side Rz of 5.1 µm
- MHT 1/2oz (‘H’ per IPC) Matte side Rz of 5.1 µm
- HP2 1/2oz (‘H’ per IPC) Matte side Rz of 7.6 µm
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TOBIII achieves peel strengths above 5.5 lbs/in, adhesion promoting nodules are plated onto the peaks of the copper dendrites to support Epoxy resin systems.
HP2 is designed for Modified Epoxy resin systems like Meg6. Not only are the nodules deposited within the peaks AND valleys of the copper dendrites but the nodules are smaller in size to increase their overall frequency and surface area with peels of 8.5 Lbs/In >.
MHT is designed to support high temperature lamination cycles typically seen when using Polyimides with Tg temps over 250° C. The foils topography achieves peels in the 5 lbs/in >.
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For further insight please reach out, I’m here to help you build better circuits!
Mark Satchwell
Product Manager, Foil & CAC®
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Fine-tuning Operations
Is Trying to “Stretch” the Most Out of Your Consumables Hurting You?
Shur-loc, IBC Brush and Equipment Service are being recognized by customers as key contributing factors in Insulectro helping them to increase their departments efficiencies in areas of their facility.
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Shurloc Frame Systems:
With a minimal cost and an immediate return on investment, the day you begin using the system and stretching……why wait?
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If your thinking of the Shur-loc Frame System and if it would save you time and costs in your screening department, then check out David Larson from Shurloc on YOUTUBE stretching a large format frame commonly used on the Circuit Automation DP1000, 1500, 2500 and 3500 series auto screen printers. Frames also available for flatbed printers and hand tables.
We can customize as well!
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Also, looking to clean your machine and hand table squeegees fast and easy? Check out this short video of their new Squeegee Cleaner! |
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Is your brush (pumice or debur) footprints even across the panel?
Do they vary in width from top to bottom and/or side to side?
There are many variables that could lead to this such as:
- The conveyor portion of the machine may be worn and no longer aligned to the brush drive system.
- The brushes themselves are not running true as they should giving a larger or smaller footprint side to side.
- Regarding pumice coils, they could be installed incorrectly onto the brush shafts.
Please reach out to us if your experiencing any of these and we’ll work with you in getting this resolved.
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Equipment service and preventative maintenance is growing for us as customers understand all the ways we can assist them with their equipment. Give us a call to discuss ways we can help support you and your maintenance team!
Remember that we can assist in your equipment needs through the following:
- Equipment Reviews and Audits
- Service and support
- Preventative Maintenance Programs
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Also, do you have a used piece of equipment you’re looking to get installed? We may be able to assist here as well!
Ruben Zambrano
Field Application Engineer
Cell: 847-345-3759
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Please reach out should you like to discuss any of these topics further.
Thank you.
Kevin Barrett,
Product Manager & TAM
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Today's Copper Foils
for Tomorrow’s Applications!
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Tailored to meet market trends such as compartment miniaturization, vehicle electrification and increased connectivity demands require improved characteristics of both wrought and ED foils.
Focus on wrought solutions such as:
- Low profile height (Rz) for signal integrity, as low as 0.4µm
- Consistent profile height across the web which does not change when ordering thicker foils
- Alloy foil with Increased tensile strengths which can exceed 700Mpa
- Grain structure in terms of large crystals and uniform orientation improves fatigue resistance and provides excellent vibration resistance.
- Thermal resistance to withstand hostile environments for automotive applications.
Wrought foils released to IPC 4562A in grade 5, grade 7 and grade 8.
Call us to find out more – we love to talk about this stuff!
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Give us a call to discuss how CAC can help you
make better circuits faster.
Mark Satchwell
Product Manager, Copper Foils
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Hard to Process Metals?
Our Beck's Light Gauge Process Is What You're Looking For
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We enjoy processing metals that most shy away from.
Our specialties include:
- 0 temper aluminum for deep drawing
- One Side Bright aluminum for the auto or name plate industry
- Clad Heat Treated Aluminum for the aerospace industry
- Litho Sheet for the printing industry
- Bright Annealed and Polished Stainless for the appliance industry
- Soft Copper
- Coated Products (aluminum or steel)
- Titanium
In other words “Jewelry”. We are a white glove, hand stacking operation giving us the ability to inspect each sheet or piece.
We have been qualified by many top Stainless and Aluminum producing mills as well as a long list of metal distributors. Many of our customers have their own cut to length equipment. Generally for a wide range of gauges.
Because our leveler was built for light gauge, we can correct flatness issues other larger roll levelers cannot. Quite often we get used to free up our customer’s line time by running the lighter gauges or more difficult time consuming jobs.
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Call Matt to find out more about our Beck's process and all that CAC® has to offer. |
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Matt Swanson
General Manager, Toll Processing
CAC®, Inc.
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Everyday Materials You Need, On Our Shelves Every Day
Insulectro recognizes the importance of maintaining adequate inventory to begin work. Designers know when you need it, you need it. Using the link getpumafast.com, you can see what PumaFast™ and standard materials we stock to get you up and running.
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Covid-19 has not stopped our ACT! initiatives!
We have successfully collaborated on many ACT! opportunities.
We are delivering on Technology, Design and Education while you can bank on the sales results!
We are virtually taking our ACT!
to another level!
Insulectro and our partners are moving the chains to help our customers exceed performance goals. Our team of professional and technical resources are now offering our customers access to design and education services.
This is a Game Changer!
Our ACT! Initiatives combined with our design and education services provide our customers a total solutions package with a one-stop-shop option.
Our customers now have total access to not only our Insulectro foot print, best in class products, materials on the shelf when you need them; but also the expertise to deliver solutions from design to delivery…FAST!
Call me and to set up a VIRTUAL ACT! with your customer.
There's a reason I'm smiling.
Ron Murdock
ACT! Manager & Technical Account Manager
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To be the easiest company to do business with. . .
Insulectro has a program for continual improvement, all designed to make ourselves as user-friendly as possible to our customers, their customers, and our suppliers. Speed Matters, so we focus a lot of attention on getting you the materials you need as quickly as possible.
Our PumaFast™ Program lists current inventory of everyday materials you need every day.
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Best-in-Class Materials
from our Premier Suppliers
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