Visit MRSI at IMAPS in October

September 2021

This Month:

MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium - October 11-14, 2021
MRSI-705 New Configuration for Higher Speed & Volume
MRSI received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
Blog Insights

MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium

MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort. There will be over 75 booths on the exhibition floor from October 12-13, 2021, with companies from all segments of the microelectronics industry including Aerospace, Automotive, Computing, Industrial, Military, and Telecom/Datacom. Stop by the MRSI Systems’ Booth (#319) to learn about our latest product innovations.

MRSI Systems Sponsors IMAPS

MRSI Systems has been a member and proud supporter of IMAPS for more than 35 years and is pleased to be the Tech-Internet Sponsor of the 2021 IMAPS Symposium. Learn more about IMAPS San Diego.

2021 IMAPS Symposium Keynote Presentations

The highlights of this year’s IMAPS Symposium are presentations on the following topics-

Packaging Technologies for Integrated Photonics
Advanced Packaging is the Future of the Semiconductor Industry
Next Generation Advanced Packaging and Thermo-Mechanical Considerations to Maximize Si Performance

See the IMAPS 2021 Technical Program for more details.

Schedule Meeting

MRSI-705 New Configuration for Higher Speed & Volume

MRSI received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder

MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in optoelectronic production, specifically the production of high-density and high-speed data center optical interconnection and backbone network transmission using 400G+ photoelectric devices, as well as 5G wireless applications using complex TO-based TOSA/ROSA devices containing DFB/WDM/EMLs. The new and innovative MRSI-HVM 1.5 micron series provides the best automated manufacturing solution for high-mix and high-volume optoelectronic production, in the era of data center / 5G, and brings the best return on investment for optoelectronic and high-power laser device manufacturing customers.