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Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials, this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. We refer to this as hexagonal boron nitride (HBN) or white graphite.
Boron Nitride has excellent electrical insulation and thermal conductivity which make the material very useful as a heat sink in high-power electronic applications. Its properties compare favourably with beryllium oxide, aluminium oxide, and other electronic packaging materials, and are easier to machine to defined shapes and sizes, making it a preferred material to produce custom-made parts within a thermal management application.
Boron Nitride (BN) is typically hot pressed into blocks and then machined to finished requirements. Compared with many ceramic materials BN is relatively easy to machine, making it an ideal material for low to medium volume production.
Temperature stability and excellent resistance to thermal shock make BN the ideal material in the toughest high-temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal-growth equipment and processing.
BN is inorganic, inert, non-reactive with halide salts and reagents, and is non-wetting when used in a molten-metal application. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.
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