At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging.
This advanced die bonder is based upon MRSI’s field proven high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics that requires ultimate accuracy at the submicron level. It has inherited the speed using multiple levels of parallel processing from the HVM platform. It also has the HVM’s high level of flexibility for multiple die applications using auto-tool changing and multiple process applications with eutectic, epoxy stamping and dispensing in one machine.
The MRSI-S-HVM flexibility is elevated to another level with the capability to switch automatically between two modes of accuracies - 0.5 micrometer and 1.5 micrometer. The 0.5 micrometer mode uses a real-time alignment mechanism facilitated by the on-axis z-force bonding for the best possible co-planarity and final accuracy. For flip-chip bonding, it aligns the features on the bonding surfaces of the die and the carrier. This eliminates the expensive step for the customer to make alignment fiducials on both top and bottom sides of a chip during wafer fabrication, and it also eliminates the subsequent die bonder alignment step in order to calibrate the top and bottom surface of the chip. All these advantages are essential for volume manufacturing capability for those emerging applications.
