2022 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY,
SIGNAL & POWER INTEGRITY
Join your colleagues IN-PERSON in Spokane, Washington, where you can share your insight, ask questions, learn from the experts/innovators and see new products at the 2022 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity. Your published paper will be seen by thousands in the EMC community and across the wide array of disciplines that look to the IEEE EMC Society for technical guidance. In addition, it will be uploaded to IEEE Xplore® with the exposure and recognition that brings.

The technical program committee has proposed Special Topic Areas: Automotive, Intentional EMI and Cybersecurity, Wireless (co-site EMI, WiFi, 5G), Robotics, and Model Based Engineering. If you have expertise in these areas, please contribute to the technical program!

In addition to Traditional Papers, the Symposium also invites authors to participate through other formats. Authors who wish to present their work without the burden of writing a full manuscript may submit an extended abstract (Abstract-Reviewed Paper). For authors wishing to informally present their work in the interactive environment of a Poster Paper, this option is also available.

If there is a special area that warrants a dedicated session with papers from a variety of excellent authors, organizers should work with one of the Technical Committees to propose a Special Session.

Workshops and Tutorials offer another way to cover a topic area. Organizers invite presentations from several speakers. These power point presentations are submitted instead of abstract-reviewed or traditional papers and are included in the symposium proceedings.

Contributors who prefer to present their work as a live experiment or demonstration can submit a proposal for Experiments & Demonstrations.
 
Papers, proposals for special sessions, workshops, tutorials, experiments and demonstrations can be submitted using our portal:

Please note the key dates below and plan your timely submission accordingly.

Thank you in advance for your contribution(s) to the Technical Program.
Sincerely,
Frank Leferink
University of Twente/THALES
EMC+SIPI 2022 Technical Program Chair
#IEEE_ESP22
KEY DATES
December 15, 2021:
Proposal for Special Sessions Submittal Deadline
January 10, 2022:
Traditional and Special Session Paper Submission Deadline
February 21, 2022:
Notification of Acceptance/Rejection for Traditional and Special Session Papers, First Round
March 7, 2022:
Abstract-Reviewed Paper, Workshop, Tutorial, and Experiments & Demonstrations Proposals Submission Deadline
March 21, 2022:
Revised Traditional and Special Session Paper Submission Deadline
April 15, 2022:
Notification of Acceptance/Rejection for Workshops, Tutorials, Experiments & Demonstrations
May 2, 2022:
Notification of Acceptance/Rejection for Traditional, Abstract-Reviewed and Special Session Papers, Final
May 16, 2022:
Final Paper, Workshop and Tutorial Submission Deadline
WELCOME TO SPOKANE, WASHINGTON!
Spokane is a sprawling city of technology, education, and beautiful geological wonders. Industries such as cloud-based software development, telecommunications, mining, waterpower plants, as well as agriculture support Spokane’s growing economy and flow of business. With the Spokane River as a centerpiece, there are countless parks and recreational areas to explore, not to mention the second largest urban waterfall in the United States located in historic downtown.

Check out over 20 local wineries, tour the esteemed Gonzaga University with its Smart Antenna and Radio Laboratory, or take a gondola ride across the Spokane Falls. Named “One of the Top 12 Scenic Cable Rides in the World” in 2013 by Conde Nast Traveler, Daily Traveller, and MSN, the Numerica SkyRide gondola offers spectacular views of the falls as well as art deco City Hall, then gradually drops down 200 feet over the Huntington Park Natural Area. 

Get ready to sail into the 2022 IEEE International Symposium on EMC+SIPI in Spokane!
Questions? Contact us at symposiuminfo@emcss.org
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