MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019 with
Mycronic - Hall A3 Booth #341
. Productronica is the world’s leading international trade fair for the development and production of electronics and will be held at Messe München in Munich, Germany.
Request a meeting
with MRSI at Productronica.
Contact
sales@mrsisystems.com
to receive a free visitor ticket.
Featured Product - MRSI-H-LD Die Bonder for Photonics and RF Applications
MRSI will demonstrate the industry-leading 1.5 micron die bonder,
MRSI-H-LD
for high-volume manufacturing of advanced
photonics
and RF / Microwave devices. The system is optimized for applications that bond large die for high-power laser diodes, industrial lasers, optical fiber amplifiers, power amplifiers, lighting, and sensors.
The MRSI-H product family provides proven superior flexibility for true multi-die, multi-process, multi-product, high-volume high-mix production. These high-speed products deliver the industry-leading speed without compromising flexibility, precision or reliability.
Configurable options include inline conveyors, dispensing, and on-the-fly auto change to provide high throughput. The MRSI-H-LD die bonder carries key technological building blocks from our field-proven, flexible, high-speed MRSI-HVM platform. It provides industry-leading throughput, superior flexibility, and future-proven 1.5 micron placement accuracy. Our customers can scale their business with this all in one solution.
RF Power Amplifiers and Microwave Device
Many of MRSI’s long-standing customers are RF and Microwave leading component manufacturers. From Transmitter and Receiver Modules to Power Amplifiers, MRSI has been the platform of choice for these manufacturers.
5G has a mobile data transfer speed that is up to 100 times faster than 4G. The RF power amplifier is a key device in wireless base stations and RF power amplifier manufacturers will need a huge capacity increase to support the rapid deployment of 5G. This new network technology and infrastructure will bring the capacities needed to cope with this increased growth in the use of communication.
Date:
12-15 November
Place:
Messe München, Munich, Germany
Mycronic Booth:
#341 in Hall A3 (SMT Cluster)
