Automotive LIDAR Conference and Exhibition 2019

Volume LI | September 2019

This Month:

Automotive LIDAR Conference and Exhibition 2019
MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics
CIOE and Infostone Conference
Blog Insights

Automotive LIDAR Conference and Exhibition 2019

MRSI Systems is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2019 Conference and Exhibition in Detroit, Michigan from September 25-26th, 2019. MRSI Systems is presenting on Thursday, September 26th. See the conference agenda for more details. Visit MRSI at Table #22 to discuss your assembly requirements.

This year’s Conference will include LIDAR focused workshops, and presentations on the following topics:

Fabrication, packaging, and system assembly techniques
Impacts of enabling technologies such as artificial intelligence
LIDAR data fusion with other types of sensors such as radar and camera
Notable academic research related to LIDAR for automotive applications
Supply chain trends and challenges
State-of-the-art LIDAR technologies

MRSI’s Solutions for LIDAR Applications

MRSI packages the core laser engine parts for LIDAR. Whether the laser engine is based upon large VCSEL array or high-power edge emitting lasers, MRSI provides the best-in-class solutions. Techniques include high placement precision, co-planarity assembly, bonder line thickness control, and delicate force control for fragile III-V laser materials (for R&D and volume production). The lasers can be bonded to all type of carrier materials such as ceramic, metal, and printed circuit board. They use eutectic reflow bonding, thermal epoxy stamping or dispensing, and in-situ UV curing. Our engineering and field applications teams are highly experienced with advanced packaging processes. They will ensure the systems are properly supported for your specific application requirements.

MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics

MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and is pleased to sponsor the exhibition lunch at the 2019 IMAPS Symposium. Over 100 booths will be on the exhibition floor from October 1-2, 2019. Companies from all segments of the microelectronics industry will attend including Aerospace, Automotive, Computing, Industrial, Military, and Telecom/Datacom. Stop by MRSI Booth #306 to learn how we can meet your assembly needs. Click here to learn more about IMAPS Boston 2019.

MRSI Systems is exhibiting at the 52nd International Symposium on Microelectronics from September 30-October 2, 2019 in Boston, MA at the Hynes Convention Center. Schedule a meeting with MRSI Systems at IMAPS Boston to learn more about how we can help meet your assembly needs. MRSI has been serving their optoelectronic and microelectronic customers for the past thirty-five years and understands the requirements to scale efficiently in today’s fast-paced marketplace.

CIOE and Infostone Conference - Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line

Thanks to our loyal customers and our partner CYCAD for making the China International Optoelectronic Exposition a success. MRSI introduced the latest advancement in the MRSI-H/HVM-series product line with the industry’s fastest 1.5 micron die bonding system for flexible high-volume manufacturing. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 micrometers at 3 sigma, to ±1.5 micrometers at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly known as MRSI-H3 and MRSI-HVM3). For more on these changes, view the recent press release .

Targeted configurations for the MRSI-H product family include WDM & EML-TO and high-power laser diode packaging. The MRSI-HVM family has extended configurations which target AOC applications. These options include inline automatic conveyorized loading/unloading, epoxy dispensing, stamping, and UV curing capability. These are critical components for newer applications such as 400G transceivers and silicon photonics.

Dr. Yi Qian, Vice President of Marketing, MRSI Systems presented "Progress in Assembly Automation: Volume Manufacturing of Photonics Devices in Data Center and 5G Era" at the Infostone 2019 Infostone Optical Communication Market and Technology Conference in Shenzhen.