MRSI’s latest article in Laser Focus World’s February Issue “
Die-bonder innovations target HPLD manufacturing challenges”
discusses the die bonding challenges for packaging High-power laser diodes (HPLDs) and presents an innovative flexible die bonder solution for both chip or bar on submount without changeover. The summary and conclusions are reproduced below:
The experiments’ results show that the MRSI H-LD die bonder provides a suitable solution to address all of the die bonding process challenges for HPLD. The machine glass die precision is less than 1 µm @3σ, better than the 1.5 µm @3σ specification, and the overhang for CoS and Chip on C-mount is less than 4 and 4.3 µm, respectively.
In addition, the linear offset for bar-on-submount is 3.8 µm, which exceeds the less-than 5 µm specification. The void percent testing results show that the machine exceeds percent-void specifications for the eutectic process in for all three package types. CoS, Chip on C-mount, and BoS packages can be built within one machine. With cycle times that achieve greater than 150 UPH for a typical CoS, the unique combination of features provides a suitable die bonding solution for high-volume and high-mix HPLD packaging production.
