MRSI Systems will be exhibiting at SEMICON West (Booth #5169) at the Moscone Center in San Francisco, CA from July 11-13, 2017. Come see MRSI at SEMICON West and we will discuss how our die bonders and dispensers may fulfill your advanced packaging needs.

MRSI Systems is a leading supplier of high precision dispense and assembly equipment for the semiconductor and microelectronics industry offering systems for the manufacture of MCM’s, Microwave, Optical, and MEM’s devices. With three decades of advanced packaging application experience, MRSI Systems' products support multiple interconnect technologies, including epoxy die bonding, eutectic attach, thermo-compression and flip chip. The ultra-precision MRSI-M3 with 3 micron capability and the MRSI-705 Die Bonders with 5 micron capability specialize in thin die handling and 3D packaging and the MRSI Systems  MRSI-175Ag Epoxy Dispenser is the leader for high precision conductive epoxy dispensing including 125 micron dots. Supported dispense technologies include auger style pumps, precision time/ pressure, stamping and jetting.

MRSI’s epoxy and eutectic die bonder, are ideally suited for high volume advanced packaging production requirements. The systems’ key features include a large configurable work area, delicate force control, advanced machine vision, programmable multi-color lighting and automatic tool changing. Our skilled engineering team with advanced packaging experience will ensure the die bonders are properly supported for your specific application requirements.