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90 Degree Flipping Mechanism
Certain devices, especially optical parts, require a 90 degree change in orientation after pick up. MRSI offers 90 degree flipping mechanisms for all our die bonders. After being picked up, a part is placed on a flipping mechanism with a vacuum pedestal. The mechanism flips the part 90 degrees. The part is then vision processed prior to pick up and placement on the substrate.
180 Degree Flipping Mechanism
Some devices, for example flip chips, require a 180 degree change in orientation after the pick up. After being picked bump side up, a flip chip die is placed on a flipping mechanism. The mechanism flips the die 180 degrees so that the bumps are down. The die is then picked up and vision processed using an upward facing camera and placed accurately onto the substrate.
Fast Ramp Eutectic Bonding Package
MRSI offers a full array of fast ramp eutectic stages This includes both in-line and batch loading eutectic stages. The batch loading stages include a pulse heating eutectic stage with fast temperature ramping capability. These stages are available in various sizes including; 15 mm x 25mm, 25 mm x 50 mm and 50 mm x 50 mm. The automatic in-line conveyorized eutectic stage includes multiple heater blocks customized to for a specific package and boat.
TO Can Package Rotational Eutectic Stage
When assembling laser diode packages a common configuration includes a eutectically attached laser diode and an epoxy die bonded photo detector. The two devices are mounted in a vertical plane 90 degrees from each other. MRSI offers a unique pulse heating eutectic stage for TO Cans with built in rotational capability.
If you have similar challenges, give our application experts a call.
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