MRSI Systems invites you to attend the live demonstration of our newly launched MRSI-HVM3, 3 Micron Die Bonder at CIOE September 6-9, 2017 in Shenzhen, China at the Shenzhen Convention & Exhibition Center. We will be hosting guests alongside our partner CYCAD Century Science & Technology at Booth
#1C66 to discuss MRSI’s product offerings including our new MRSI-HVM3. Please schedule a system demonstration by emailing your contact or directly to
sales@mrsisystems.com
.
The MRSI-HVM3 is a high speed, high precision, flexible, 3 micron die bonder for high-volume manufacturing of photonics devices. MRSI Systems is introducing this new 3 micron die bonder for high-volume manufacturing of photonic, sensor, and semiconductor devices. The MRSI-HVM3 delivers industry leading speed without sacrificing high precision or flexibility. MRSI’s latest hardware and software innovations include ultra-fast ramp eutectic stations and multiple levels of parallel processing utilizing dual gantries, dual bonding stages, and “on-the-fly” tool changes for multi-chip, multi-process production. If you are looking to increase capacity, please come experience the benefits of the best-in-class die bonder for Chip-on-Carrier (CoC) Assembly.
This year we are pleased to sponsor “The 1st Executive Forum on Laser Technologies” September 6-7, 2017 during CIOE. We are looking forward to discussing, with worldwide industrial and academic leaders, new laser technologies and applications in communications, sensors, industrial and other emerging areas.
Learn more about the forum
.
