Dear all, I hope you are all handling the Coronavirus as best you can, and your family and friends are all doing well. This has been something none of us have every experienced before and we can only guess when everything will get back to some type of normalcy.
In the previous newsletter I introduced you to Thermo Cool, our new heat-dissipating product. In this issue I would like to go into more detail regarding the various applications. When we originally designed the product we were looking at it as strictly a coated layer on top of the solder mask to help dissipate heat, but as we progressed with the project and discussed the product with customers and OEMs we found that it could also be used as a Thermal Interface Material (TIM) for LEDs, an adhesive/underfill for some types of packaging applications, and lastly, as a via fill product.
At the most recent EIPC Winter Conference in Rotterdam, a presentation was given on how to use through holes as a method for heat dissipation. This presentation created a prime opportunity because the presenter hadn't heard about our Thermo Cool product. Fortunately, we were able to enjoy a nice cold beverage afterwards and discussed using Thermo Cool in his application for heat dissipation. I fully expect to have some results in our next newsletter to share with you on this testing. Below are some illustrations on the various applications for Thermo Cool:
For Via Filling
As a Thermal Interface Material (TIM)
As an Adhesive/Underfill
Lastly, here is a comparison of a standard heat spreader and the new Thermo Cool 10.2W.
Please feel free to contact me or any of your Taiyo resources to learn more. We look forward to hearing from you and hopefully we will be back visiting you very soon!
