MRSI's recent article
High-power Laser Diodes: Die-bonder innovations target HPLD manufacturing challenges
provides an overview of the following manufacturing challenges:
- precision, eutectic quality, percent voids, and coplanarity
- high-mix, high-volume production
- placement accuracy and repeatability
- temperature profile in the reflow process
- growth and complexity of form factors
The experiments’ results show that the MRSI H-LD die bonder provides a perfect flexible manufacturing system (FMS) solution to address all of the die bonding process challenges for HPLD.
