Volume XL | October 2018
MRSI-HVM3 High Speed Die Bonder Family for CoC, AOC, & Gold-box Packaging

MRSI Systems expanded its successful high speed HVM3 platform with more configurations for AOC and Gold-box packaging in addition to CoC. The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (<3 micron) and superior flexibility for true multi-process multi-chip high-volume production. 
MRSI Systems launched the new MRSI-H3 product family at the recent CIOE show with two specialized configurations for WDM/EML-TO and high power laser assembly, respectively. The new MRSI-H3 product family delivers industry-leading speed, future-proof high precision (<3 micron) and superior flexibility for true multi-process multi-chip high-volume production.
Thank you to everyone who visited MRSI Systems at the recent shows including EPS, ECOC, Automotive LIDAR, and IMAPS Pasadena.
MRSI Blog - Weekly Insights into the Advanced Electronic Packaging Industry 
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