Volume XL | October 2018

This Month: MRSI-HVM3 Family Expansion MRSI-H3 High Speed Die Bonder Video Trade Show News Blog Insights

MRSI-HVM3 Family Expansion

MRSI-HVM3 High Speed Die Bonder Family for CoC, AOC, & Gold-box Packaging MRSI Systems expanded its successful high speed HVM3 platform with more configurations for AOC and Gold-box packaging in addition to CoC. The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (<3 micron) and superior flexibility for true multi-process multi-chip high-volume production.

MRSI-H3 High Speed Die Bonder Family for WDM/EML-TO

MRSI Systems launched the new MRSI-H3 product family at the recent CIOE show with two specialized configurations for WDM/EML-TO and high power laser assembly, respectively. The new MRSI-H3 product family delivers industry-leading speed, future-proof high precision (<3 micron) and superior flexibility for true multi-process multi-chip high-volume production.

Trade Show News

Thank you to everyone who visited MRSI Systems at the recent shows including EPS, ECOC, Automotive LIDAR, and IMAPS Pasadena.

Blog Insights MRSI Blog - Weekly Insights into the Advanced Electronic Packaging Industry  Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform Software Video Training Programs for Die Bonding and Epoxy Dispense Systems High Volume Manufacturing of Photonic Devices: Assembly Starts with Design

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