MRSI Systems – “One Stop Shop” Product Demo at CIOE (China International Optoelectronic Expo)

Volume XXXVIII | August 2018

This Month:

MRSI Systems – “One Stop Shop” Product Demo at CIOE
Laser Focus World: Challenges for photonics manufacturing in the new data center era
Trade Show News
Blog Highlights

MRSI Systems – “One Stop Shop” Product Demo at CIOE

MRSI Systems invites you to attend the live demonstration of our MRSI-HVM3, 3 Micron Die Bonder at CIOE September 5-8, 2018 in Shenzhen, China at the Shenzhen Convention & Exhibition Center. We will be jointly hosting guests with our partner CYCAD Century Science & Technology’s at Booth #1C66 to discuss your requirements and MRSI’s product offerings. Please schedule a system demonstration by emailing your contact or directly to sales@mrsisystems.com .

Our theme at the show will be around our "One Stop Shop" product family. Our MRSI-705 (5μm) and MRSI-M3 (3μm) die bonders are historically regarded the leaders in flexibility. Last year, MRSI Systems introduced the first high speed product – MRSI-HVM3 (3μm) for CoC packaging. This year we expanded this product family with the launch of the additional configuration, MRSI-HVM3P for AOC/PCB and Gold-box packaging. In addition, we introduced the MRSI-H3 (3μm) family with specialized configurations MRSI-H3TO for WDM & EML-TO packaging and MRSI-H3LD for high power diode laser packaging. These high speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability.

With our “One Stop Shop” solutions, we can meet whatever volume our customers face. The ultra-flexible MRSI-705 and MRSI-M3 can be used for research and development prototyping to low/medium volume. The ultra-fast MRSI-HVM3 and MRSI-H3 can meet high volume requirements for all key die bonding applications in photonics manufacturing with superior flexibility for multi-dies, multi-process, and multi-products through one machine. Based upon the same hardware and software platforms, there will be no tool changeover risk for NPI by eliminating the changes of controls or processes already qualified during the development phase. Finally, our ultra-fast product families deliver <3μm placement accuracy for next generation products while improving process yields for manufacturing of current products by tightening assembly tolerance as early as possible in assembly.

Our “One Stop Shop” solutions will help our customers to enable just-in-time supply and fast-pace innovations of critical photonic component for high growth market segments such as hyper-scale data centers, photonic sensors, and 5G wireless.

If you are looking to increase capacity please come experience the benefits of the best-in-class die bonders for photonic manufacturing. Visit MRSI Systems Website for more information.

Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics manufacturing, which requires flexible, high speed, and high precision automation to enable just-in-time supply and fast pace innovations of critical components to hyper-scale data centers.

These generational changes facing the photonics manufacturing industry have created significant challenges and opportunities. The article explains these in some detail and outlines new solutions that have emerged. A brief abstract is reproduced below:

The high-volume and high-mix nature of manufacturing for hyperscale data centers requires flexible, high speed, and high precision automation to enable just-in-time supply and fast innovations of critical photonics components.

The data generated by the exponential growth rate of Internet traffic is enormous and data centers are crucial to support the resulting data communications, storage, and processing needs through cloud computing. Photonic devices play vital roles in these data centers, and this has posed significant challenges to photonics high-volume manufacturing (HVM).