Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Volume XLV | March 2019

This Month:

Article
Trade Show News
Blog Insights

Challenges and Solutions for Bonding Ultra-Small Ceramic
End-Terminated Capacitors

Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end markets in Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial.

Moore's Law is the observation made by Intel co-founder Gordon Moore that the number of transistors on a chip doubles every 18 months. As with transistors, the volumetric efficiency of multilayer chip capacitors (MLCC) continues to make dramatic improvements. Volumetric efficiency of capacitors is a measure of the performance of electronic function per unit volume. For capacitors, the volumetric efficiency is denoted by the "CV product." CV is the product of the capacitance (C) and maximum voltage rating (V) and divided by the volume. As shown in the following graph, volumetric efficiencies have improved dramatically for MLCC. The result is increased use of ultra-miniature capacitors.

Customer Support and Training Programs

MRSI Systems offers a variety of service contract options to provide fixed cost material, labor and expenses for machine repairs. In addition, we offer preventative maintenance and calibration programs to ensure your machines are operating at top efficiency. Our comprehensive training programs offer a cost efficient solution to our customers from basic operator training to more advanced programming. Please have your system serial number available when you call for service so that we can continue to provide optimal customer service using our CRM system. We are dedicated to learning more about our

customers and how to better serve you.

MRSI On-Site Training Programs

Based at our North Billerica, Massachusetts, US headquarters, MRSI offers a comprehensive set of training programs covering our family of products. Led by experienced engineers, the programs are tailored to suit each customer’s needs, including concepts of robot orientation, teaching alignments, the die bonding process and production set up.

The sessions are run over a 3 to 5 day period depending on the specific program. These are hands-on

training programs and attendees will learn the following key features of our products:

1. How to program your die bonding and epoxy dispensing systems e.g. how to teach a waffle pack and teach a tip to perform tasks.

2. The major features of our software platform common to our systems including the intuitive Windows™ interface and how it simplifies the set-up and production process.

3. How to access the library of waffle pack and die.

4. How to set up calibration routines.

5. How to turn a simple machine into a powerful tool to allow die and placement locations to be taught for use in the future.

6. Ability to use die in multiple programs and to reteach easily.

7. Alternate die capability allowing the system to automatically switch between alternate vendors of die.

8. Our sophisticated advanced vision systems, enabling rapid detection and orientation of die over a full 360°.

These training programs can also be run at a customer’s site. Please contact our service department at service@mrsisystems.com or call 978-667-9449 for details on service contracts and these programs.

Software Training Videos

MRSI is offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems. These videos are the perfect tool for training new operators of MRSI machines and as a refresher course for existing users. These cost effective videos are a great alternative to on-site training for new and existing operators, technicians and engineers. Contact MRSI to purchase the latest training videos to program your die bonding system and epoxy dispenser today.

Trade Show News

Thanks for visiting the Booth at OFC. The traffic at the show booth certainly kept us busy and is an indication of the upbeat market conditions. It was a great opportunity to see our existing and new customers.

IMAPS New England

May 7, 2019

46th Symposium & Expo

Boxborough, MA USA

Rajiv Pandey, Senior Product Manager, MRSI Systems will present High-Speed, High-Precision and High-Flexibility, Automated Die-Bonder for High-Power Laser Diode (HPLD) Packaging . MRSI’s die-bonders are deployed in the packaging of a variety of photonics components e.g. CoC, CoS, TOSA, ROSA, AOC, TO cans and Gold-Boxes, which are used in building optical networks and high-power lasers. Mr. Pandey has worked in the laser industry for the better part of two decades in various engineering and management positions with Spectra-Physics (MKS Instruments), DILAS (Rofin/Coherent), Synrad (Novanta), Teradiode (Panasonic) and EM4 (Gooch and Housego). He started his early career as a Process Engineer in high-power laser diodes manufacturing and for the past 15 years has been in product management roles. Mr. Pandey earned his MS in Chemical Engineering from the University of Arizona and his B.Sc. in Chemical Engineering from the University of Manchester Institute of Science and Technology (UK).