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Volume XXXII | January 2018
MRSI Newsletter
MRSI Systems - IEEE Tech Insider Webinar January 25th:
The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications 
Presented by Dr. Yi Qian, Vice President of Product Management, MRSI Systems

Internet traffic has been growing at an exponential level, continuously driven by video streaming, 3D imaging, IoT, VR/AR, and other emerging data applications. The data generated by internet traffic is enormous and data centers are crucial to support data communications, storage and processing through cloud computing. Photonic devices such as optical transceivers play vital roles in modern data centers. Demand for photonic devices is at an unprecedented level. And the technology upgrades to support this demand are expected to happen at the same time as this volume ramps, e.g. 40G to 100G and to 200G/400G and beyond.

These requirements have posed significant challenges to photonic device manufacturing. To support data center build-up, the photonic device companies need to maintain an “elastic capacity model” to respond fast to data center customer’s demands, and at the same time to maintain low manufacturing costs to produce profits. This calls for much higher levels of manufacturing automation than the photonic industry has ever experienced. In addition, the co-existence of many product standards requires that manufacturing automation is flexible to allow multiple products, e.g., single die Fabry-Perot (FP) laser submount and multiple die electro-absorption laser (EML) submount assembly, to go through the same production lines without sacrificing throughput. Furthermore, more and more advanced technologies demand higher and higher precision in assembly automations, again without sacrificing speed and throughput. High speed, high precision, and high flexibility for the high volume manufacturing of photonic devices require closer collaboration than ever between device designers, process developers, manufacturing engineers, and automation equipment suppliers. This webinar will discuss these trends, challenges, and opportunities.

Please join us Thursday, January 25, 2018 at 11:00 AM EST
CoS
The demand for data and bandwidth continues to expand, resulting in the requirement for high-volume manufacturing (HVM) of photonics devices at unprecedented levels.This expansion, with double-digit growth rates,is driven by data consumption from cloud computing, web and mobile-based applications and storage through hyperscale data centers (e.g., Facebook, Google, Microsoft, Amazon). The data bandwidth demand from individual consumers and enterprises creates the need to upgrade long haul networks, metropolitan communication systems, and data centers.

One key photonic device component requiring HVM is the chip-on-submount (CoS). CoS devices present some unique manufacturing challenges. Application specific die bonders have evolved over decades to address the current manufacturing demands of CoS. This article reviews the required features of a successful HVM die bonder of CoS devices.

对数据和带宽的需求持续扩张,导致大批量生产 (HVM) 光器件的需求达到前所未有的水平。此扩张达到两位数的增长率,受数据消费所驱动,由诸如云计算,网络和基于手机的应用程序,以及通过超大规模数据中心(如Facebook、Google、Microsoft 及 Amazon)的存储等需求衍生。个人消费者及企业的数据带宽需求催生了远程传输网络、都市通信系统和数据中心的升级需求。

基板上芯片 (CoS) 是一种需要大批量生产 (HVM) 的关键光子器件组件。CoS器件的出现对生产提出了一些独特的挑战。过去几十年间,专用贴片机得到长足发展,从而满足了当前 CoS 的生产需求。本文对成功的CoS器件大批量生产贴片机所应具有的功能进行了回顾。

This article was Originally published in Chip Scale Review – July August 2017 Issue
MRSI Systems' Story
Visit MRSI in San Francisco
MRSI Systems will be exhibiting at SPIE Photonics West for the first time this year. SPIE Photonics West Exhibition will be held at the Moscone Center in San Francisco, CA from January 30-February 1, 2018. This is the flagship event for companies in the photonics and laser industries. There is expected to be 1,300 exhibitors and over 20,000 attendees. Please visit the MRSI Booth #4568. We look forward to seeing you in San Francisco. Request a meeting with MRSI Systems at SPIE Photonics West. Learn about the upcoming events MRSI Systems will be attending.
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