Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically geared to these challenging applications.
MRSI-705 5 Micron Die Bonder
The MRSI-705, 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 die bonder is a flexible configurable platform, with the largest installed base in the industry for advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more.
The MRSI-705 die bonder is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of ±5 microns and flexibility achieved by leveraging the die bonder platform’s signature features:
- Large Work Area - The unique overhead gantry design of the MRSI-705 translates into a large work area that easily accommodates a wide variety of material inputs and outputs.
- The die bonder can pick from any combination of Gel-Paks®, waffle packs, wafers, and tape feeders.
- Advanced Vision System - The die bonder’s advanced vision system enables rapid detection and orientation of die over a full 360° and the vision system aligns and places die according to substrate fiducials, the die edge, or relative to features of previously-placed die.
- Traceability - The MRSI family of high precision die bonders includes software to track material as the products are assembled.
- Tri-color (red, green, and blue) stadium lighting is combined with a collimated light source to enable the processing of the widest range of die, substrates and packages.
- Material Handling - Tooling is modular, ensuring fast, easy change-over between production runs.
- Force Control - Force control on the MRSI die bonders is the result of years of evolution and is the benchmark in the industry today. Proprietary force control algorithms allow faster placements without force overshoot. This applies at forces as low as 10 grams and as high as 2kg.
- MRSI Systems Windows Software intuitive graphical user interface, running on Windows™ simplifies the set-up and production process. The user interface is common to all MRSI die bonders and epoxy dispensers.
