October 4, 2013 
Welcome to MRSI Solutions Newsletter. This periodic newsletter  provides information on our latest happenings and product updates. 
  
Many thanks to our loyal customers for their continued interest in our products.
In This Issue
    

 
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Upcoming Events:
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MRSI Solutions
For Dispense and Assembly
  
Ultra-Thin Die Wafer Handling
 
Servo Drive of Needle Mechanism Synchronized with Pick Up Collet
Thin die handling has become a common need
among customers building high performance packages. MRSI is known as a leader in the industry for handling thin die. One key feature that enables MRSI's systems to handle thin die is a servo drive needle mechanism. This means that the needle mechanism motion profile is well controlled. The needle mechanism motion is fully synchronized with the pick-up collet to ensure controlled pick up from the wafer. The collet has the "feather touch" force control for which MRSI's systems are well-known.
Large Aspect Ratio Die Wafer Picking
 
Automatic Wafer Theta Mechanism  

Newport MRSI systems are specialized to handle large aspect ratio devices. Key features for handling large aspect ratio devices include wafer table theta correction, advanced pattern recognition and delicate force control. The wafer table theta correction aligns the wafer theta in real time so that each individual die pick-up is aligned in theta to the needle lift cluster. Proprietary needle cluster designs ensure the die are picked correctly. The large aspect ratio pick collet is automatically aligned in theta to match the die angle. Delicate force is ensured through the MRSI "feather touch" collet force control.

     
  
              
         Wafer Table Theta Correction  
  • Real Time Automatic Wafer Theta  Adjustment  
  • Each Individual Die is Aligned
  • Proprietary Needle Cluster Designs
  • Specialized for Large Aspect Ratio Die 
 
Single, Dual and Multi Wafer Versions
  • Chip Flip Mechanism
  • Upward Facing Vision Camera
  • Tri-Color Lighting
  • Ink Dot and Wafer Mapping
 
Wafer Adapter Rings
 
 
 
Large Wafer Adapter 
  
Pick from stretch frames and/or rings.  This wafer adapter provides the flexibility to handle large wafers.  Ink dot recognition and wafer mapping are both standard options.
 
Medium Wafer Adapter
  
The Newport wafer adapter series provides the utmost flexibility for both R&D and production to handle a variety of wafer sizes and saw rings/frames on a single wafer table. 
Small Wafer Adapter
  
Ideal for III-V materials such as GaAs and InP which tend to come in small wafer formats.  This small wafer adapter provides the user with the flexibility to handle both small and large wafers.
Multiple Wafer Capability
 
Waffle Pack Adapter
  
When configured to maximize the number of waffle packs the MRSI-705 can accommodate up to 96 waffle packs.
  

In addition, when configured with one or multiple wafers an adapter ring is available which provides the flexibility to hold waffle packs in place of wafers on the wafer table. This adapter plate is available for multiple 2" x 2" waffle packs or 4" x 4" waffle packs.

Semicon Taiwan and IMAPS 2013

Thanks for Visiting the Booths at Semicon Taiwan and IMAPS 2013!

 

The traffic at the show booths certainly kept us busy and is an indication of the upbeat market conditions. It was a great opportunity to see our existing and new customers. Thank you to our agent EverIsland for their hospitality in Taiwan. Discussions centered around our traditional market strengths such as Microwave Modules, Photonics Packaging and complex MCM assembly, as well as some of the newer applications such as Active Optical Cables (AOC) and 2.5/3D Thermo Compression Bonding. 

 

Next stop is the 10th Anniversary IWLPC in San Jose, California on November 6-7, 2013. We hope to see you there! Click on the show logo link for more details

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See us at IWLPC November 6-7, 2013 !
Need More Information, Please Contact Dan Crowley at:
+1.978.667.9449
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