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In this Issue:
- Our latest blog post: High Volume Manufacturing of Photonic Components and Modules. Read More
- Upcoming Events
- Customers Visit Billerica
- MRSI Expands Customer Support
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High Volume Manufacturing of
Photonic Components and Modules
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In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates is driven by increased data consumption. The data bandwidth demand from individual consumers and enterprises creates the need to upgrade long haul networks, data centers and metropolitan communication systems.
The Transistor Outline package (more commonly referred to as TO packages) is an industrial standard package. TO packages are popular for low cost, high volume manufacturing of photonic components and modules such as Laser, Transmitter Optical Sub Assembly (TOSA), Receiver Optical Sub Assembly (ROSA), etc.
Die Bonding in TO packages presents some unique manufacturing challenges. MRSI’s family of die bonders have evolved over a three decade legacy to be ideally suited to address the manufacturing demands of die bonding photonic components and modules in TO packages.
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MRSI will be exhibiting at these shows, which feature comprehensive sessions and networking events. We see these shows as a great opportunity to meet our complete industrial
supply chains and garner insights to technical and business intelligence.
We hope to see you there!
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Optical Fiber Communication Conference
- March 19-23, 2017
- Location: Los Angeles, California, US
- MRSI Booth #1728
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Device Packaging IMAPS
- March 6-9, 2017
- IMAPS 13th International Conference and Exhibition on Device Packaging is the largest conference focused on: Interposers, 3D IC & Packaging; Fan-Out, Wafer Level Packaging & Flip Chip, and Engineered Micro Systems/Devices.
- Location: Fountain Hills, Arizona USA
- MRSI Booth #44
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Semicon China 2017
- March 14-16, 2017
- Semicon China is the Microelectronics Exhibition for China’s semiconductor industry.
- Location: Shanghai, China
- Cycad Century Science & Technology Host
- Booth W2 – 2543
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Customers Visit Billerica
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Drew Lee, James Rayna, and Cesar Romo from Northrop Grumman in CA, recently visited Billerica to perform a factory acceptance on their latest MRSI-705 Die Bonders. MRSI Systems has enjoyed a mutual long term strategic relationship with Northrop Grumman. MRSI Systems provides Northrop Grumman fully automated dispensing and die bonders solutions for complex microelectronics assembly.
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Sun from MIT, in Cambridge, MA recently visited Billerica to complete a factory acceptance of MIT's MRSI-M3 die bonder. This is the first die bonder MIT has purchased from MRSI.
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MRSI Expands Customer Support
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To meet the demand of our rapidly growing business, MRSI continues to expand our customer support organization with the addition of Jason Liu in China.
Peter Cronin, Director of Applications and Service states "Jason is an experienced engineer who has worked for many years in die bonding, dispense and automation."
Please welcome Jason Liu! In addition to our existing staff, Jason is here to help you succeed.
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MRSI-705
5-MICRON DIE BONDER
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MRSI-175Ag
EPOXY DISPENSER
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MRSI-M3
3-MICRON DIE BONDER
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MRSI-M1
1-MICRON DIE BONDER
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Copyright © 2017. All Rights Reserved.
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