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In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN
Applications, such as RF Power devices, require high speed solutions which include automated in-line material handling with integrated eutectic die attach capability. The industry leading MRSI Die Bonders provide a turn-key solution for high speed automated eutectic die attach. The material handling system loads the boat onto the conveyor. The conveyor transfers the boat to the bonding area as it incrementally heats the package to the process temperature by passing over preheat zones. At the bond station the substrate comes into contact with the pulse heated bonding stage and the eutectic bonding process is performed. For Gold Silicon direct eutectic, the system aligns the package and then picks and places the die, scrubbing (variable amplitude and frequency) to accomplish the eutectic bonding. A heated cover gas of Hydrogen and Nitrogen is present over the bonding area. For solder reflow eutectic bonding, such as Gold Tin (Au/Sn) eutectic attach of Gallium Arsenide (GaAs) and Gallium Nitride (GaN) die, the system aligns the package and picks and places and places a preform onto the package (if required, the preform can be pre-deposited). The die is then picked and placed, while the temperature at the bonding position is ramped using a pulse heated eutectic stage and scrubbed (variable amplitude and frequency) to accomplish the eutectic reflow. A heated cover gas of Hydrogen and Nitrogen is present over the bonding area. The boat is indexed to the next substrate position and the above process is repeated until all the boat positions have been bonded. As the indexer transfers the boat, the parts are incrementally cooled by passing over cool down zone position. When completed the indexing conveyor transfers the boat to the output magazine loader. If you have similar challenges, give our application experts a call.
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