MRSI Systems has been in development of an automated system and processes for thermo compression bonding that enables new methods of assembling semiconductor devices utilizing advanced electronics packaging technologies (including 2.5D/3D).  The tool provides optimal tool design and process requirements for achieving successful (defect free) bonding. The  development includes prototype tooling and processes for fluxless thermo compression bonding of flip chip die, as well as capillary underfill dispensing.

 

MRSI Systems is a leading supplier of high-performance, high-accuracy die bonding and dispensing systems to the microelectronics industry. MRSI is now applying its deep expertise in these areas to address the significant  

technological challenges of sub-3 micron thermo compression bonding of 2.5D and 3D devices and is partnering with a leading computer company in this effort.

 

"The increasing complexity and decreasing feature sizes of advanced semiconductor devices present significant challenges in the packaging process," said Mike Chalsen, President  of MRSI Systems.