Volume 5 
  
Oct 1, 2014   
  
Welcome to Solutions Newsletter. This periodic newsletter  provides information on our latest happenings and product updates. 
  
Many thanks to our loyal customers for their continued interest in our products.
In This Issue
     
  
  
 October 13- 16, 2014
  
  
Click Here to See a Full List of Shows and Events
  
Solutions Newsletter

For Dispense and Assembly
  
Precision Dispensing of Conductive Epoxy
 
MRSI-175 Ag Delivers Unparalleled Dispensing of Conductive Epoxy  

MRSI Systems, a leading manufacturer of dispense and assembly equipment for semiconductor and photonic packaging, is now offering its industry leading MRSI-175 Ag with a Rotary Style Positive Displacement Pump with a new higher resolution motor.  This means the MRSI-175Ag has even better performance. 
  
The MRSI-175Ag dispenser offers a wide variety of application specific pump technologies including a rotary positive displacement auger pump for precise, continuous dispense of small dots, lines, arcs and areas.  The system allows for quick change-over from dispensing conductive epoxy to dam and fill and underfill materials. The systems' advanced vision system combined with programmable tri-color lighting assures accurate fiducial registration for precise placement of dispensed patterns.  Laser height sensing maintains critical dispense heights. 

 

The system features two dispense heads.  These heads can be used for two dispense pumps one dispense pump and one stamping head.  Automatic tip calibration, tip cleaning, and purge stations make setup quick and easy. 

 

The MRSI-175 Ag is frequently selected based upon the ease of programming.  The MRSI-175Ag uses the same icon based interface running on a Windows™ as the MRSI family of die bonders, thus reducing

training time and improving productivity. The MRSI-175 Ag may be configured for manual part loading, magazine to magazine part handling, or for in-line production.

 

Contact us about your dispensing challenges chances are we have already solved them!

   

 

 MRSI-175Ag Precision Conductive Epoxy Dispenser
Come See Us at IMAPS 2014

 

IMAPS 2014 is the largest symposium related to the microelectronics packaging industry in the world. IMAPS 2014 will feature a powerful technical program, a state-of-the-art exposition, progressive professional development courses, another informative Global Business Council Marketing Forum and many other events and activities to share the latest developments in microelectronics.

 

The Annual IMAPS Symposium attracts approximately 1,000 attendees who represent all facets of the microelectronics and electronic packaging industries. These include: engineers, technicians, R&D, purchasing, manufacturing, management, and many more. They represent the automotive, communications, medical, aerospace, computer, defense, homeland security and consumer industries.

 

 

Come see us at booth 231 Exhibition and Conference :
October 14-15, 2014

 

 

 
 

MRSI - M3

Assembly Work Cell

MRSI - M5

Assembly Work Cell 

MRSI-705

Assembly Work Cell 

MRSI-175Ag

Epoxy Dispenser 

MRSI-M3MRSI-M5
MRSI-705
MRSI-175Ag
Need More Information, Please Contact us at:
+1.978.667.9449
      

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