MRSI Die Bonding Machine Provides Required Features
Many applications including RF Power, Optical and MEMS require large, thin, high aspect ratio devices. Aspect ratios can exceed 45 to1.
Examples include: RF Power Die (6 mm x 1 mm), MEMS Die (25 mm x 0.5 mm) and Optical Modulators (90 x 2 mm). These large ratio devices have other characteristics which require delicate and special handing including:
The MRSI Die Bonders have evolved to deliver a robust production solution to successfully overcome these application challenges. The systems design incorporates many advanced features specifically designed for thin, large high aspect ratio devices, including:
- Programmable delicate force handing
- Die ejector synchronized to collet motion
- Automatic wafer theta compensation per die
- Advanced machine vision and lighting
- Excellent co-planarity control
- Bond line control for epoxy die attach
- Eutectic process control for eutectic bonding
- Ultra-precision placement accuracy
- Custom collet designs
If you have similar challenges, give our application experts a call.
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