Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges

Volume LX | August 2020

This Month:

Published Article: Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
Video Updates: MRSI-H-LD Die Bonder
PR Latest: MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
Blog Insights: MRSI solves one of the greatest challenges in modern photonics manufacturing

Assembly solution addresses TO-can photonic device manufacturing challenges

5G networks are the next generation of mobile internet connectivity, and field deployments have started globally. It is expected to supercharge Internet of Things (IoT) technology, providing the infrastructure needed to carry vast amounts of data that allows for a smarter and a more connected world with a far more powerful communication infrastructure. 5G is driving the vastly increased demand for high-performance advanced optical devices due to meet this demand at an affordable cost.. To meet the 5G infrastructure cost target, many novel TO-CAN packages used for the high-speed TOSA/ROSA/BOSA/BIDI/Diplexer/Triplexer as well as pump laser components are being developed for low cost pluggable transceivers or EDFAs in 5G network. The TO-CAN packages may reduce the packaging materials cost. However, cost-effective automation tools are needed to support the low-cost volume manufacturing for these complex high-performance TO-CAN, which have multi-chips/dies high-precision attached in a small TO-CAN package by different processes. This article will discuss the challenges of the novel TO-Can packages assembly automation. And it also will present an innovative solution for those new generations of TO-Can packaging automation, to respond to the challenges for manufacturing the unique parts that require high-quality and high-efficiency assembly processes for any special TO-Can packages.

MRSI-H-LD Die Bonder

MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos

CIOE 2020

September 9-11, 2020
Shenzhen World Exhibition & Convention Center
Booth #8E55

MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September 7-8, 2020. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems, will be presenting “Innovative Assembly Solutions: Volume Manufacturing of Novel Devices in the 5G Era.”

MRSI Systems will exhibit at the 22nd China International Optoelectronic Exposition (CIOE). Live product demos will be offered at MRSI’s booth #8E55. The show will be held at the Shenzhen World Exhibition & Convention Center from September 9-11, 2020.

MRSI will demonstrate the industry-leading 1.5 micrometer die bonder, MRSI-H-LD for high-volume manufacturing of advanced photonics and RF/microwave devices. The system is optimized for applications that bond large die for high-power semiconductor lasers, RF power amplifiers, active optical cables (AOCs), lighting, and sensors. This versatile assembly solution enables our customers to scale their business by delivering high throughput, high reliability, and high flexibility.