What should we bump them up to for the next year? I had just heard about 1GB storage devices and suggested we get as much as we could now. But the rest of the team decided that 500M was plenty. Well, it didn’t take long for the situation to be “re-evaluated”. The result: in 6 months, those 500M HDs had to be replaced with 1G HDs…with additional expense in downtime and staff hours.
The moral of this story: with electronics, it is always better to plan for more than to settle for less. Ultimately, it costs less in time and money.
Today, there are some new developments coming on the market that are going to blow away how we integrate ourselves in our electronic world. With wearables, smaller networking devices, and high-speed holographic beam forming (HBF) communication devices, our world is going to change drastically – again.
Only a few organizations have been working on developing this technology. That said, momentum is picking up speed from other companies - like Microsoft and Google.
While HBF technology has been used in audio conferencing systems for a while, boundaries are now expanding, due to a breakthrough in electro-magnetic physics. HBF offers a low cost, size, weight and power envelope to increase the 5G network speed, capacity, and efficiency. It is one of the most exciting technological developments I see coming in 2018 and the near future. Plan for it!
Cherie Litson, MIT CID+ is a veteran PCB designer with over 30 years of advanced-level experience in every market sector. An independent consultant, she shares her knowledge with the industry as a speaker and instructor. Cherie is a Master Instructor for the IPC Designer Certification program, and her next class will be in Seattle on September 15-19. For more information about the course:
www.EPTAC.com
or Connect with the Expert at
Cherie@CalderaDev.com
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