This seminar goes beyond the basics of Electromagnetic Compatibility (EMC) and Signal Integrity (SI) to help participants understand the fundamental physics involved and to be able to make trade off decisions when the normal rules-of-thumb cannot be applied.

Thank you for your interest in the Advanced Seminar for EMC & Signal Integrity. Registration for this event is now closed.

What to Expect?

If you have taken basic training, here is your chance
to bring it to the next level. This course will teach you
how to apply the basics to more complex problems.

Join Bruce as he shares seminar details so you know
what to expect when you attend. 

Seminar Overview

Day 1: Fundamentals 

• Common Mode Noise from High Speed Differential Signals
• High speed board-to-board connector analysis
• Electromagnetic Band Gap Filters
• PCB power decoupling myths busted

Day 2: Signal Integrity

• Using lossy materials to mitigate EMI at GHz frequencies
• Survey of EMC/SI simulation techniques and tools and their strengths/weaknesses

Day 3: Decision Making

• Breaking real-world complex problems into realistic simulation models
• Validation of modeling/simulations
• Possible pitfalls with specific vendor modeling tools

Course Details

Today’s very high frequency data rates bring their own sets of issues for both EMC and SI.  Board-to-board connectors may be electrically large and become antennas.  Traditional shielding approaches are often impossible to implement for these high frequencies.  New techniques, such as electromagnetic band gap filters, lossy/absorbing materials and other new design options are required. In addition to new design approaches, a new set of tools is available to the engineer to allow a more accurate estimation of the electromagnetic effects of a system, before that system is ever built.  Electromagnetic modeling can help isolate important features, study the physics associated with specific features, and optimize the overall problem based on a new understanding of the physics related to the specific features required at high frequencies.

This seminar includes a complete assessment of modeling techniques available today.  And, more importantly, we use detailed examples of how-to create models for a wide variety of disciplines.  Intra-system EM coupling (self-jamming) between digital and analog/RF circuits (conducted or radiated), radiated emissions/immunity from printed circuit boards, cables, antennas, and other general devices are all discussed and demonstrated against real-world problems.  We explore critical validation of modeling techniques and modeling codes, as well as standard modeling problems to help build comprehensive evaluation proficiency.

Focusing on real-world problems participants will learn how to perform EMC modeling and simulation techniques including quasi-static, full wave, fast solvers, and combinations of these techniques.  Full wave techniques include Finite-Difference Time-Domain, Method of Moments, Finite Element Method, Partial Element Equivalent Circuit technique and more.  It is key for users to understand how these techniques work in order to determine which is most appropriate for the problem at hand.  Specific software tools will be discussed.

About the Instructor

Dr. Bruce Archambeault is an IEEE Fellow, an IBM Distinguished Engineer Emeritus and an Adjunct Professor at Missouri University of Science and Technology.  He received his B.S.E.E degree from the University of New Hampshire in 1977 and his M.S.E.E degree from Northeastern University in 1981.  He received his Ph. D. from the University of New Hampshire in 1997.  His doctoral research was in the area of computational electromagnetics applied to real-world EMC problems.  He has taught numerous seminars on EMC and Signal Integrity across the USA and the world, including the past 12 years at Oxford University.

Dr. Archambeault has authored or co-authored a number of papers in computational electromagnetics, mostly applied to real-world EMC applications.  He is a member of the Board of Directors for the IEEE EMC Society and a past Board of Directors member for the Applied Computational Electromagnetics Society (ACES).  He currently serves as the chair for the Technical Activities Committee and Vice president for Conferences of the EMC Society.  He has served as a past IEEE/EMCS Distinguished Lecturer and Associate Editor for the IEEE Transactions on Electromagnetic Compatibility.  He is the author of the book “PCB Design for Real-World EMI Control” and the lead author of the book titled “EMI/EMC Computational Modeling Handbook”.